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PMV22EN

NXP Semiconductors

PMV22EN by NXP Semiconductors

PMV22EN from NXP Semiconductors is a compact N-channel FET designed for efficient switching applications. It features a max drain current of 5.2 A, a breakdown voltage of 30 V, and low on-resistance of 0.022 Ω. Ideal for surface mount designs in various electronic circuits.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 3 parts In-Stock

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$1.000

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Chip Stock

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Vyrian

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Anansix

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AZTECH Wire

Italy . 2,986 parts In-Stock

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One Stop Electronics

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Kepictronics

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Authorized Procurement Solutions

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UNI Independent Distributors

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Futuretech Components

Singapore . 710 parts In-Stock

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Ashlea Components Ltd (Excess)

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Overview

Elevate your designs with the PMV22EN from NXP Semiconductors, a top-tier N-channel FET crafted for reliability and performance. Renowned for its commitment to quality, NXP ensures that this compact, surface-mount transistor delivers exceptional switching capabilities in diverse applications. Experience reduced power loss and improved efficiency, empowering your innovations with a trusted solution that keeps your projects ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection from environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, which enhances performance, making this device an excellent choice for efficient switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection against reverse polarity, increasing the reliability of the circuit in which the FET is used.

Transistor Application: SWITCHING

Designed for switching applications, this product can effectively control power to various loads, making it ideal for power management circuits.

Surface Mount: YES

The surface mount capability allows for compact designs and simplifies the manufacturing process, thus enhancing product integration in modern electronics.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures that this FET can handle standard voltage levels in various applications while maintaining reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to fit into various designs, providing flexibility in layout and saving space on printed circuit boards (PCBs).

Terminal Form: GULL WING

Gull wing terminals are designed for easy soldering and provide excellent mechanical support, enhancing the reliability of connections in electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption until activated, making this FET an energy-efficient choice for many applications.

No. of Terminals: 3

Having three terminals simplifies the design and keeps the connection straightforward, reducing complexity in circuit assemblies.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for high-density designs without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables fast switching speeds and low power consumption, making this FET suitable for high-frequency and low-power applications.

Transistor Element Material: SILICON

Silicon as the transistor element material provides excellent thermal conduction and stability, contributing to overall reliability and performance.

Terminal Finish: TIN

Tin finish on the terminals ensures good solderability and corrosion resistance, which enhances the robustness and longevity of the component.

Maximum Drain Current (ID): 5.2 A

With a maximum drain current of 5.2 A, this FET can handle substantial load currents, making it suitable for a variety of high-power applications.

Maximum Drain-Source On Resistance: 0.022 ohm

A low on-resistance of 0.022 ohm minimizes energy loss, making the FET highly efficient during operation and enhancing overall circuit performance.

Terminal Position: DUAL

Dual terminal position increases flexibility in circuit layout and connection design, allowing for better integration with other components.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV22EN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

5.2 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV22EN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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