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PMV28UN

NXP Semiconductors

PMV28UN by NXP Semiconductors

PMV28UN by NXP Semiconductors is a compact N-channel FET designed for efficient switching applications. It features a max drain current of 3.3 A, a breakdown voltage of 20 V, and low on-resistance of 0.032 Ω. Ideal for surface mount designs in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,796 parts In-Stock

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Anansix

USA . 647 parts In-Stock

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647

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Digiode

USA . 141 parts In-Stock

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141

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One Stop Electronics

USA . 984 parts In-Stock

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$2.050

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984

$2.050

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AZTECH Wire

Italy . 8,559 parts In-Stock

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$3.040

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$3.040

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Kepictronics

USA . 306,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,604 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Supply Digital

USA . 1,686 parts In-Stock

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1,686

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RC Electronics

USA . 1,200 parts In-Stock

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$0.130

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$0.130

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$0.120

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Corphita

USA . 74 parts In-Stock

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Overview

Unlock unparalleled performance with the PMV28UN from NXP Semiconductors, a trusted leader in innovative solutions. This N-channel FET is designed for seamless switching applications, offering superior efficiency and reliability in a compact package. With its built-in diode and low on-resistance, it minimizes energy loss, ensuring your projects run smoothly. Elevate your designs with this high-quality component that blends cutting-edge technology with exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and allows for cost-effective production of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance in terms of efficiency, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse polarity, improving the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for controlling large loads in power management circuits.

Surface Mount: YES

Surface mount capability allows for easy integration into compact PCB designs, promoting efficient use of space.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20 V provides adequate protection against voltage spikes, enhancing circuit reliability.

Package Shape: RECTANGULAR

The rectangular shape promotes stable mounting and allows for easier PCB layout design in compact applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering properties, ensuring a robust connection to the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower quiescent current and improved efficiency in active applications.

No. of Terminals: 3

With only three terminals, the FET is simplified, reducing potential layout issues and enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, maximizing performance without excessive footprint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance, leading to lower power losses and enhanced performance in switching applications.

Transistor Element Material: SILICON

Silicon material ensures high thermal stability and efficiency, translating to reliable operation over a wide range of temperatures.

Terminal Finish: TIN

Tin finish enhances solderability and ensures a strong electrical connection, contributing to long-term reliability.

Maximum Drain Current (ID): 3.3 A

A maximum drain current of 3.3 A allows for handling larger loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.032 ohm

Low on-resistance minimizes power loss during operation, improving overall efficiency and thermal performance.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in design and layout, facilitating easier routing on printed circuit boards.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV28UN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.3 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV28UN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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