Loading...

PMV28UN,215

NXP Semiconductors

PMV28UN,215 by NXP Semiconductors

PMV28UN,215 by NXP Semiconductors is an N-channel FET designed for switching applications. It features a max drain current of 3.3 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Its compact surface mount design ensures efficient performance in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,345

-

-

-

-

Anansix

USA . 2,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,559

-

-

-

-

Vyrian

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,182

-

-

-

-

Semtec, LLC

USA . 1,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 200 parts In-Stock

1+ parts

$0.673

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$0.673

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.097

100+ parts

$0.998

1k+ parts

$0.900

10k+ parts

-

350

$1.097

$0.998

$0.900

-

One Stop Electronics

USA . 756 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

-

756

$2.050

-

-

-

AZTECH Wire

Italy . 7,590 parts In-Stock

1+ parts

$6.150

100+ parts

-

1k+ parts

-

10k+ parts

-

7,590

$6.150

-

-

-

Kepictronics

USA . 12,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,350

-

-

-

-

UNI Independent Distributors

Spain . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

Corphita

USA . 3,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,844

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,769

-

-

-

-

Supply Digital

USA . 411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

411

-

-

-

-

Overview

Elevate your designs with the PMV28UN,215 from NXP Semiconductors—a premium N-channel small signal FET that brings reliability and efficiency to your applications. With its robust construction and advanced MOS technology, this versatile transistor excels in switching tasks, ensuring seamless performance even under demanding conditions. Trust in NXP’s reputation for quality and innovation, and unlock unparalleled value and reliability for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the FET suitable for a range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and lower on-resistance, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against back EMF, improving reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimally suited for use in power management circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V allows this FET to handle higher voltages, providing versatility in various circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout on the PCB, enabling optimized placement and routing.

Terminal Form: GULL WING

Gull wing terminals offer better solderability and can enhance the reliability of connections in automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and switching performance, suitable for precision applications.

Maximum Drain Current (Abs) (ID): 3.3 A

Supporting a maximum drain current of 3.3 A allows for robust performance in higher power applications.

No. of Terminals: 3

A simple 3-terminal design makes the FET easy to integrate into various circuit architectures.

Maximum Power Dissipation (Abs): 0.52 W

With a power dissipation of 0.52 W, this FET operates efficiently, reducing thermal stress in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact electronic designs, valuable in space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances the switching speed and efficiency, making it suitable for fast signal processing applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based transistors provide good electrical performance and are widely used, ensuring availability and reliability.

Terminal Finish: TIN

Tin finish enhances solderability, ensuring reliable connections during assembly.

Maximum Drain-Source On Resistance: 0.032 ohm

Low on-resistance minimizes power loss during operation, leading to improved efficiency.

Terminal Position: DUAL

Dual terminal positioning aids in versatile layout options and simplifies routing on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with modern soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is optimal for ensuring reliable solder joins without damaging the component.

Reference Standard: IEC-60134

Meeting the IEC-60134 standard confirms the component's reliability and ensures adherence to international quality benchmarks.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV28UN,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

3.3 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

IEC-60134

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV28UN,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19