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PMV20XNEA

NXP Semiconductors

PMV20XNEA by NXP Semiconductors

PMV20XNEA by NXP Semiconductors is a single N-channel power FET with built-in diode for switching applications. It features a min DS breakdown voltage of 20V, max pulsed drain current of 25A, and max power dissipation of 6.94W. This MOSFET operates in enhancement mode and has a max operating temperature of 150°C, making it suitable for various electronic devices requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 93,000 parts In-Stock

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Digiode

USA . 4,822 parts In-Stock

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Vyrian

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Anansix

USA . 1,028 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Aztec Data Supply Inc.

USA . 63 parts In-Stock

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$0.531

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Corohmni

South Africa . 1,162 parts In-Stock

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$1.329

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AZTECH Wire

Italy . 11,374 parts In-Stock

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Ampacity Inc.

Singapore . 753 parts In-Stock

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$28.050

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One Stop Electronics

USA . 399 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,893 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Kepictronics

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

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UNI Independent Distributors

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Supply Digital

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Aranea Global

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Overview

Experience the power and efficiency of the PMV20XNEA by NXP Semiconductors. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance in switching applications, with a maximum pulsing drain current of 25 A and a minimum DS breakdown voltage of 20 V. With a built-in diode and small outline package style, this N-CHANNEL transistor provides enhanced functionality and reliability. Trust in NXP Semiconductors to deliver cutting-edge technology for your electronic projects. Elevate your designs with the PMV20XNEA's superior capabilities and maximize the potential of your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

This FET is specifically designed for switching applications, making it highly efficient in controlling power flow.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage ensures that the FET can handle high voltage applications with reliability.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on the circuit board.

Terminal Form: GULL WING

Gull wing terminals make it easy to solder the FET onto the board securely.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 25 A

High pulsed drain current capability allows the FET to handle sudden spikes in current.

No. of Terminals: 3

Simple 3-terminal design for ease of use in circuit design.

Maximum Power Dissipation (Abs): 6.94 W

High power dissipation capability ensures the FET can handle high power applications efficiently.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high reliability and performance for the FET.

Maximum Operating Temperature: 150 °C

High operating temperature range allows the FET to function in a wide range of environments.

Transistor Element Material: SILICON

Silicon is a common and reliable material used in transistors for its excellent semiconductor properties.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the FET to operate in cold environments without issues.

Maximum Drain Current (ID): 6.3 A

High drain current rating ensures the FET can handle the required current in the circuit.

Maximum Drain-Source On Resistance: 0.02 ohm

Low on-resistance ensures minimal power loss and high efficiency in power switching applications.

Terminal Position: DUAL

Dual terminal position allows for versatile soldering options in circuit design.

Maximum Feedback Capacitance (Crss): 144 pF

Low feedback capacitance helps in reducing signal distortion in high-frequency applications.

Reference Standard: IEC-60134

Compliance with international standards ensures product quality and compatibility with various systems.

Technical Specifications

Power Field Effect Transistors (FET) PMV20XNEA attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

6.3 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

144 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV20XNEA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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