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PMV20XN

NXP Semiconductors

PMV20XN by NXP Semiconductors

PMV20XN by NXP Semiconductors is an N-channel FET designed for efficient switching applications. It features a max drain current of 4.8 A, a breakdown voltage of 30 V, and operates at temperatures from -55 °C to 150 °C. Ideal for compact power management solutions in electronics.

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4

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1k+

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Chip Stock

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AZTECH Wire

Italy . 9,815 parts In-Stock

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One Stop Electronics

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Kepictronics

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UNI Independent Distributors

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Supply Digital

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Overview

Unlock unparalleled efficiency with the PMV20XN from NXP Semiconductors, a leader in innovative solutions. This N-channel power FET combines cutting-edge design and reliability, making it ideal for switching applications in diverse sectors like automotive and industrial automation. Experience superior performance and thermal resilience that helps reduce energy consumption while enhancing system longevity. Trust in NXP’s commitment to quality and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability, making the FET suitable for various applications while ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, providing better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates reverse operation, improving efficiency and reducing circuit complexity.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in tasks such as signal modulation and power regulation.

Surface Mount: YES

Surface mount technology enables compact designs and efficient manufacturing processes, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 30 V

A breakdown voltage of 30 V ensures reliable operation in various conditions, providing a safety margin for many applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space, enabling easier integration into existing designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, enhancing component stability on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves efficiency and reduces power loss, making this FET suitable for low-power applications.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current capability allows for versatile applications, enabling it to handle demanding load conditions.

No. of Terminals: 3

The three-terminal design simplifies integration into circuits, making it easier for designers to implement.

Maximum Power Dissipation (Abs): 4.17 W

A maximum power dissipation rating of 4.17 W ensures the FET can handle substantial power without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances layout flexibility and saves space on printed circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET very efficient.

Maximum Operating Temperature: 150 °C

Withstanding high operating temperatures ensures reliability and longevity in demanding environments.

Transistor Element Material: SILICON

Silicon materials are widely used in FETs due to their excellent thermal properties and performance characteristics.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions makes this FET suitable for a range of environments.

Terminal Finish: TIN

The tin finish provides good solderability and protection against corrosion, enhancing the longevity of connections.

Maximum Drain Current (ID): 4.8 A

A maximum drain current of 4.8 A offers significant versatility in circuit applications, allowing for various load currents.

Maximum Drain-Source On Resistance: 0.025 ohm

Low on-resistance reduces power loss during operation, improving overall efficiency of the device.

Maximum Feedback Capacitance (Crss): 55 pF

Low feedback capacitance contributes to fast switching speeds, enhancing performance in high-frequency applications.

Reference Standard: IEC-60134

Compliant with international standards, ensuring quality and reliability in diverse market applications.

Technical Specifications

Power Field Effect Transistors (FET) PMV20XN attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

4.8 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

55 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV20XN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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