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PMT29EN

NXP Semiconductors

PMT29EN by NXP Semiconductors

PMT29EN from NXP Semiconductors is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 6A, a breakdown voltage of 30V, and low on-resistance of 0.036Ω. Ideal for compact electronic designs with surface mount capabilities.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Anansix

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AZTECH Wire

Italy . 6,757 parts In-Stock

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One Stop Electronics

USA . 1,129 parts In-Stock

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UNI Independent Distributors

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Corphita

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Supply Digital

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Perfect Parts

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Overview

Elevate your designs with the PMT29EN from NXP Semiconductors, a powerhouse in small signal FET technology. Known for their exceptional quality and reliability, NXP offers you a versatile solution for efficient switching applications. With its compact size and built-in diode, this N-channel transistor delivers outstanding performance while simplifying your layout. Trust in NXP's expertise to enhance your project's efficiency and innovation, making your systems smarter and more reliable.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers excellent durability and protection, making the product suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel configurations generally provide better performance and efficiency, making this FET ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by minimizing component count while providing necessary protection against reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power and signals, enhancing overall circuit performance.

Surface Mount: YES

Surface mount capability ensures space-saving designs and simplifies assembly processes in modern electronics.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures reliability and operates effectively in circuits requiring higher voltage handling.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of PCB space, ensuring better layout and design flexibility.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and facilitate easy soldering, enhancing assembly quality.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to higher efficiency and lower power consumption, making this FET ideal for low-power applications.

No. of Terminals: 4

Four terminals allow for a versatile range of circuit configurations, making this FET adaptable to various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for compact designs, suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-input impedance and lower power consumption, making it a preferred choice for efficient electronic designs.

Transistor Element Material: SILICON

Silicon as the element material provides reliability and high performance, ensuring consistent operation across a wide range of temperatures.

Terminal Finish: TIN

Tin finish enhances solderability and provides good corrosion resistance, ensuring reliable connections in various environments.

Maximum Drain Current (ID): 6 A

A maximum drain current of 6 A indicates robust performance, making this FET suitable for high-current applications.

Maximum Drain-Source On Resistance: 0.036 ohm

Low on-resistance minimizes conduction losses, enhancing efficiency during operation, making it suitable for high-efficiency designs.

Terminal Position: DUAL

Dual terminal positioning aids in layout flexibility on PCBs, allowing for streamlined integration into diverse circuit designs.

Case Connection: DRAIN

Designing with the case connected to the drain enhances thermal management and reliability, critical for high-power applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMT29EN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMT29EN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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