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PCF8811U/2DA/1,026

NXP Semiconductors

PCF8811U/2DA/1,026 by NXP Semiconductors

PCF8811U/2DA/1,026 by NXP Semiconductors is a CMOS interface IC designed for segment displays. It operates b/w 1.8V and 3.3V, supports up to 128 segments, and functions in extreme temperatures from -40 °C to 85 °C, ideal for industrial applications. With a max supply current of just 0.25 mA, it ensures energy efficiency.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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One Stop Electronics

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AZTECH Wire

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Microchip USA

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Overview

Elevate your designs with the PCF8811U/2DA/1,026 from NXP Semiconductors, renowned for its superior quality and innovation. Designed for industrial applications, this versatile interface IC offers exceptional reliability in extreme temperatures, ensuring peak performance in any environment. With low power consumption and support for multiple display configurations, it empowers customers to create efficient, eye-catching displays that stand out in today's competitive landscape. Experience the unmatched value and benefits of partnering with a trusted leader in semiconductor solutions!

Feature Benefit Bullets

Display Mode: SEGMENT

The SEGMENT display mode is ideal for applications requiring clear and precise visual indicators, making this product suitable for a wide range of electronic devices.

Power Supplies (V): 1.8/3.3

Supporting dual power supply levels of 1.8V and 3.3V enhances flexibility in design, accommodating various system voltages for better integration.

No. of Backplanes: 80-BP

An 80 backplane configuration allows for extensive control over a large number of segments, enabling complex displays in industrial and consumer applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is well-suited for high-temperature environments, ensuring reliability in demanding applications.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40 °C makes this product ideal for harsh environments, such as outdoor and industrial settings.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this product is engineered for long-term stability and performance in challenging conditions.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high performance, making this product energy-efficient and suitable for battery-operated devices.

Maximum Supply Current: 0.25 mA

A maximum supply current of just 0.25 mA ensures minimal energy usage, which is critical for portable applications and contributes to longer battery life.

No. of Segments: 128

With 128 segments available, this product can display complex information and detailed graphics, making it a versatile choice for various display applications.

Technical Specifications

Other Function Interface ICs PCF8811U/2DA/1,026 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

80-BP

No. of Segments:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.25 mA

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF8811U/2DA/1,026 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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