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PCA9541AD/03,118

NXP Semiconductors

PCA9541AD/03,118 by NXP Semiconductors

PCA9541AD/03,118 by NXP Semiconductors is a bus controller with 16 terminals and a rectangular package shape. It operates at a supply voltage range of 2.3V to 5.5V and has an industrial temperature grade of -40°C to 85°C. This IC is commonly used for I2C communication in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,612 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Sensible Micro Corp

USA . 1,940 parts In-Stock

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Digiode

USA . 1,740 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Anansix

USA . 389 parts In-Stock

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389

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Distributors (Availability)

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Microchip USA

USA . 3,525 parts In-Stock

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$10.285

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One Stop Electronics

USA . 616 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 799 parts In-Stock

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$17.838

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Ampacity Inc.

Singapore . 820 parts In-Stock

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$25.000

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Corohmni

South Africa . 4,955 parts In-Stock

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$61.924

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Aztec Data Supply Inc.

USA . 4,934 parts In-Stock

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$68.835

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Perfect Parts

USA . 5,600 parts In-Stock

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

Spain . 4,908 parts In-Stock

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Continental Prestige Electronics

USA . 4,683 parts In-Stock

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Corphita

USA . 3,941 parts In-Stock

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Argo Parts USA

USA . 1,370 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the power of seamless communication and enhanced efficiency with the PCA9541AD/03,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. The PCA9541AD/03,118 falls under the category of bus controllers, offering incredible versatility across various applications. With its compact rectangular shape and small outline package style, it's perfect for space-constrained designs. Experience the benefits of this product, such as its wide supply voltage range, high operating temperature, and moisture sensitivity level 1. Don't miss out on the opportunity to streamline your operations and unlock endless possibilities with the PCA9541AD/03,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures the product is lightweight and durable, making it a reliable choice for various applications.

Surface Mount: YES

This product is designed to be surface mounted, providing easy and efficient installation onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this bus controller can support power-hungry systems, providing a reliable power source for connected devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient placement on circuit boards, optimizing the available board area for other components.

No. of Terminals: 16

This bus controller offers a sufficient number of terminals, allowing it to interface with multiple devices or subsystems, expanding its versatility in a system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps to minimize the occupied space on a PCB, enabling compact and streamlined system designs.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement allows for energy-efficient operation, contributing to overall power savings and extending battery life where applicable.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the bus controller can handle demanding environments, making it suitable for industrial applications with elevated temperature conditions.

Minimum Operating Temperature: -40 °C

With a wide minimum operating temperature range, this bus controller excels in both extreme cold and hot environments, increasing its usability across various industries.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides excellent resistance against corrosion, ensuring reliable electrical connections and an extended product lifespan.

Terminal Position: DUAL

The dual terminal position allows for flexibility in PCB layout, simplifying the routing of signals and enhancing the overall design efficiency.

Maximum Seated Height: 1.75 mm

The low maximum seated height assists in achieving a compact system profile, enabling the design of sleek and slimline devices.

Width: 3.9 mm

The narrow width of the bus controller makes it suitable for space-constrained applications, where compact form factors are essential.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures a proper soldering process during assembly, leading to reliable connections and product performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with standard soldering processes, simplifying the manufacturing and assembly of electronic devices.

Length: 9.9 mm

The length of the bus controller aligns with industry standards, ensuring ease of integration into existing systems or alongside other components.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this bus controller is suitable for applications that demand reliable performance under harsh environmental conditions.

Peripheral IC Type: BUS CONTROLLER, I2C

This bus controller is specifically designed as an I2C peripheral IC, making it ideal for interfacing various devices using the I2C communication protocol.

Technology: CMOS

The use of CMOS technology in this bus controller ensures low power consumption, making it an energy-efficient choice for battery-powered systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process during assembly, allowing for easy and reliable connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage requirement aligns with common power supply standards, making it compatible with a wide range of systems and power sources.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides a suitable spacing for efficient PCB assembly and layout, enhancing ease of use in system integration.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this bus controller has excellent resistance to moisture-related failures, ensuring product reliability even in humid environments.

Technical Specifications

Bus Controllers PCA9541AD/03,118 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PCA9541AD/03,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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