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FT312D-32Q1C-R

FTDI

FT312D-32Q1C-R by FTDI

FT312D-32Q1C-R by FTDI is a 32-terminal bus controller with a max supply voltage of 3.63V and operating temperature range from -40 to 125 °C. It features a square package shape, very thin profile, and supports up to 12 MHz clock frequency. Ideal for automotive applications requiring USB peripheral ICs in compact designs.

Median Price

$2.759

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.759

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600

$2.759

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Vyrian

USA . 5,885 parts In-Stock

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5,885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,203 parts In-Stock

1+ parts

$2.759

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2,203

$2.759

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Continental Prestige Electronics

USA . 257 parts In-Stock

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$2.759

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$2.704

257

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$2.704

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$2.814

100+ parts

$2.814

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$2.814

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60

$2.814

$2.814

$2.814

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AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$13.264

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778

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Aztec Data Supply Inc.

USA . 2,718 parts In-Stock

1+ parts

$82.060

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Overview

Unlock endless possibilities with the FT312D-32Q1C-R by FTDI, a top-of-the-line bus controller that promises unrivaled quality and reliability. Manufactured by FTDI, a trusted name in the industry, this versatile chip carrier is perfect for automotive applications and boasts a wide operating temperature range. With a maximum clock frequency of 12 MHz and a low seated height of just 1mm, this surface-mount chip offers customers unmatched value and performance. Experience seamless connectivity and enhanced functionality with the FT312D-32Q1C-R - the ultimate solution for all your USB bus control needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to integrate this bus controller into compact electronic devices.

Maximum Supply Voltage: 3.63 V

Compatible with a wide range of power supply voltages, providing flexibility in implementation.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on PCBs.

Power Supplies (V): 3.3

Operates on a standard voltage supply, making it easy to integrate into existing systems.

No. of Terminals: 32

Sufficient number of terminals for connecting to various peripheral devices and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides multiple packaging options to suit different design requirements and thermal management needs.

Minimum Supply Voltage: 2.97 V

Works reliably even at lower supply voltages, ensuring stable operation in different conditions.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, ensuring performance in harsh environments.

Terminal Position: QUAD

Quad terminal position allows for easy connectivity and facilitates efficient routing of signals.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm saves space in compact electronics.

Width: 7 mm

Narrow width of 7mm enables compact PCB layout and efficient use of board space.

Maximum Clock Frequency: 12 MHz

Supports high clock frequencies, enabling fast data transfer and communication between devices.

Length: 7 mm

Compact length of 7mm complements the narrow width for efficient board space utilization.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Performs as a bus controller for managing data transfer and supports the universal serial bus standard for compatibility.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: NO LEAD

No lead terminal form offers reliability and simplified manufacturing processes for surface mount technology.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage of 3.3V ensures compatibility with various power sources.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65mm allows for dense packing of terminals and efficient signal routing.

Technical Specifications

Bus Controllers FT312D-32Q1C-R attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Maximum Clock Frequency:

12 MHz

JESD-30 Code:

S-XQCC-N32

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

FT312D-32Q1C-R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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