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PCA9504ADGG

NXP Semiconductors

PCA9504ADGG by NXP Semiconductors

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.867

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 344 parts In-Stock

1+ parts

$1.867

100+ parts

$1.960

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$1.848

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344

$1.867

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Cyclops Electronics Ltd

UK . 10,157 parts In-Stock

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Vyrian

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Digiode

USA . 2,617 parts In-Stock

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Anansix

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R&J Components

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Sea View Technologies

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Semi Source

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A2Z Electronics, Inc.

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Bristol Electronics

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Ashlea Components Ltd

UK . 56 parts In-Stock

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North Shore Components

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LWI Electronics Inc

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One Stop Electronics

USA . 705 parts In-Stock

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$34.000

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UNI Independent Distributors

Spain . 7,709 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Assy Fe

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Corphita

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Perfect Parts

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Technical Specifications

Other Function Logic ICs PCA9504ADGG attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

PCA9504ADGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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