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PCA82C251T/N,112

NXP Semiconductors

PCA82C251T/N,112 by NXP Semiconductors

PCA82C251T/N,112 by NXP Semiconductors is an 8-terminal network interface IC with a 5V supply voltage. It operates in automotive-grade temperatures (-40 to 125 °C) and features CMOS technology. This small-outline package is ideal for interface circuit applications in the telecom industry.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,629 parts In-Stock

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Digiode

USA . 2,158 parts In-Stock

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Anansix

USA . 799 parts In-Stock

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799

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 232 parts In-Stock

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$7.134

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Corohmni

South Africa . 104 parts In-Stock

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$14.916

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Aztec Data Supply Inc.

USA . 305 parts In-Stock

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$16.260

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One Stop Electronics

USA . 1,337 parts In-Stock

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$62.000

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Semicontronic

India . 1,408 parts In-Stock

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$195.000

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$190.125

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$189.150

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Ampacity Inc.

Singapore . 1,309 parts In-Stock

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$321.000

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Corphita

USA . 4,846 parts In-Stock

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Microchip USA

USA . 3,575 parts In-Stock

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UNI Independent Distributors

Spain . 2,479 parts In-Stock

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Argo Parts USA

USA . 2,051 parts In-Stock

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Continental Prestige Electronics

USA . 1,411 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Advanced Electronics

New Zealand . 39 parts In-Stock

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Overview

Unlock seamless network connectivity with the PCA82C251T/N,112 by NXP Semiconductors. Designed with top-quality materials and cutting-edge technology, this network interface offers unparalleled performance for a wide range of automotive applications. With its compact design and reliable operation, customers can trust in the value and benefits that this product brings to their projects. Say goodbye to connectivity issues and hello to efficiency with the PCA82C251T/N,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for long-term use in various environments.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards, reducing assembly time and potential errors.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures easy integration into existing electronic systems, saving valuable space.

Power Supplies (V): 5

The 5V power supply ensures compatibility with a wide range of devices and systems, making this product versatile and easy to incorporate.

No. of Terminals: 8

With 8 terminals, this product offers flexible connection options, allowing for customization and adaptability to different setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for a compact design, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making this product suitable for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature guarantees consistent operation in cold environments, enhancing the product's reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved stability in connections, reducing the risk of errors or malfunctions.

Maximum Seated Height: 1.75 mm

The low maximum seated height facilitates a slim profile, ensuring compatibility with tight spaces and streamlined designs.

Width: 3.9 mm

The narrow width of the product enables efficient use of space on circuit boards, optimizing layout and reducing clutter.

Length: 4.9 mm

The compact length of the product further contributes to space-saving designs, allowing for more flexibility in system setups.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade enhances the product's durability and reliability, making it suitable for automotive applications and other demanding environments.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and enhanced performance, contributing to energy efficiency and extended battery life.

Terminal Form: GULL WING

The gull-wing terminal form offers secure connections and ease of soldering, simplifying the installation process and ensuring robust electrical connections.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit telecom IC type provides seamless communication between devices, facilitating reliable data transfer and connectivity.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures consistent and stable power delivery, supporting reliable operation and compatibility with standard electronic systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise alignment and connection, minimizing the risk of errors and signal interference.

Technical Specifications

Network Interfaces PCA82C251T/N,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

PCA82C251T/N,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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