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PBR941

NXP Semiconductors

PBR941 by NXP Semiconductors

NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 8000 MHz; Maximum Power Dissipation (Abs): .36 W; Maximum Collector Current (IC): .05 A;

Median Price

$0.336

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 172,000 parts In-Stock

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$0.280

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$0.280

Flip Electronics (Authorized)

USA . 172,000 parts In-Stock

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Verical

USA . 168,000 parts In-Stock

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$0.392

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Vyrian

USA . 75 parts In-Stock

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$0.280

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American Microsemiconductor Inc.

USA . 2,600 parts In-Stock

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$0.550

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Chip Stock

USA . 240,500 parts In-Stock

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DigiKey Marketplace

USA . 172,000 parts In-Stock

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Flip Electronics

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Connector Distribution Corp

USA . 12,000 parts In-Stock

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Right Parts Inc.

USA . 12,000 parts In-Stock

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Bristol Electronics

USA . 5,418 parts In-Stock

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PC Components Company LLC

USA . 5,168 parts In-Stock

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BCID Electronics Ltd.

Israel . 3,340 parts In-Stock

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Digiode

USA . 2,270 parts In-Stock

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Anansix

USA . 1,605 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 549 parts In-Stock

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Inventory MP

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Kepictronics

USA . 306,000 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 6,549 parts In-Stock

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UNI Independent Distributors

Spain . 3,818 parts In-Stock

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Corphita

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Assy Fe

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Glotronic Ltd.

UK . 439 parts In-Stock

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Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) PBR941 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE, HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

10 V

Configuration:

Minimum DC Current Gain (hFE):

50

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

PBR941 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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