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N74F02N

NXP Semiconductors

N74F02N by NXP Semiconductors

N74F02N by NXP Semiconductors is a TTL logic gate with a propagation delay of 5.3 ns, operating at a nominal voltage of 5V. It features 4 functions and supports dual inputs, making it ideal for various digital applications. Its compact design ensures efficient performance in commercial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Pride Electronics

USA . 6,270 parts In-Stock

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Vyrian

USA . 3,053 parts In-Stock

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Anansix

USA . 2,420 parts In-Stock

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Resion

USA . 1,423 parts In-Stock

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Digiode

USA . 1,273 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Electronic Expediters

USA . 150 parts In-Stock

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

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50

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Corel Iberica Componentes, S.L.

Spain . 50 parts In-Stock

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Inland Empire Components Inc.

USA . 49 parts In-Stock

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One Stop Electronics

USA . 915 parts In-Stock

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$28.000

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Corphita

USA . 2,672 parts In-Stock

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UNI Independent Distributors

Spain . 1,288 parts In-Stock

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Futuretech Components

Singapore . 719 parts In-Stock

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Assy Fe

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Overview

Unlock exceptional performance with the N74F02N from NXP Semiconductors, a leader in innovative logic solutions. This versatile dual-input logic gate ensures reliability and speed, making it perfect for diverse applications from consumer electronics to industrial automation. With its robust design and superior propagation delay, you gain enhanced efficiency and durability, empowering your projects with the quality and precision NXP is renowned for. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and cost-effectiveness for a wide range of applications.

Propagation Delay At Nominal Supply: 6.5 ns

With a low propagation delay, this logic gate can operate at high speeds, making it ideal for fast digital circuits.

No. of Functions: 4

Having multiple functions in one package allows for versatile circuit designs and reduces component count.

No. of Inputs: 2

With two inputs, this logic gate can handle a variety of logic operations, facilitating the design of complex circuits.

Package Shape: RECTANGULAR

The rectangular package shape is standard for many applications, ensuring compatibility with various PCB layouts.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5V makes this product compatible with most digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF means this device can interface easily with other logic ICs and maintain signal integrity.

Power Supplies (V): 5

Single power supply of 5V simplifies design and reduces the need for multiple voltage regulators.

No. of Terminals: 14

With 14 terminals, the device provides ample connection points for various input and output configurations.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into circuit boards and aids in better assembly processes.

Maximum I (ol): 20 Amp

A high maximum output current capability of 20A allows the device to drive larger loads directly.

Propagation Delay (tpd): 5.3 ns

An even shorter propagation delay of 5.3 ns enhances the performance in high-speed applications.

Maximum Operating Temperature: 70 °C

Rated for a maximum operating temperature of 70 °C, this product is suitable for various environments while maintaining reliability.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows this logic gate to function well in cooler conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB design and easier placement in tight spaces.

Maximum Seated Height: 4.2 mm

A low seated height of 4.2 mm ensures compatibility with low-profile designs and compact applications.

Width: 7.62 mm

The width of 7.62 mm is standard, making it easy to integrate into existing designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for flexibility in power supply arrangements while ensuring performance.

Maximum Time At Peak Reflow Temperature: 40 s

The ability to withstand up to 40 seconds at peak reflow temperature makes it suitable for modern soldering techniques.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with high-temperature soldering processes.

Length: 19.025 mm

The length of 19.025 mm fits well within the standard sizes for logic gate packages, aiding in ease of design.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for general-purpose applications, making this product widely applicable.

Technology: TTL

Using TTL technology ensures reliability and speed, crucial for various digital logic applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and is favored in prototyping and PCB assembly.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm (0.1 in) is widely used, ensuring compatibility with existing designs and easy soldering.

Maximum Supply Voltage (Vsup): 5.5 V

Operating up to a maximum supply voltage of 5.5V offers increased flexibility while maintaining safe operation.

Maximum Power Supply Current (ICC): 13 mA

A maximum supply current of 13 mA ensures efficient operation while conserving power in the overall system.

Technical Specifications

Logic Gates N74F02N attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

13 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

N74F02N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-366-2706, 5962013662706

NIIN

013662706

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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