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N74F32D

Onsemi

N74F32D by Onsemi

N74F32D by Onsemi is a TTL logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 5V, with a propagation delay of 6.6ns. This small outline package is ideal for commercial applications requiring fast signal processing in a compact form factor.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 400 parts In-Stock

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$1.150

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$0.870

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$0.750

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TEDSS.com

USA . 2,500 parts In-Stock

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Prism Electronics

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Vyrian

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PC Components Company LLC

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Pegasus Components GmbH

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R&J Components

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Component Sense

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Digiode

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Inland Empire Components Inc.

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ACDS - Activité Composants Distribution Service

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Anansix

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Atlantic Semiconductor

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ABC Electronics Ltd.

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Extreme Components

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LWI Electronics Inc

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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ECAB

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Elcom Components

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Semi Source

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Inventory MP

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Speed Components Ltd

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GES GmbH

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Sogenti Electronics

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Corohmni

South Africa . 237 parts In-Stock

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AZTECH Wire

Italy . 4,329 parts In-Stock

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One Stop Electronics

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Cyclops Electronics Ltd (Excess)

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UNI Independent Distributors

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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Problanco Electronics

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Corphita

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Assy Fe

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Futuretech Components

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UHIMA Technologies

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Supply Digital

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GreenTree Electronics

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Overview

Upgrade your electronic projects with the N74F32D logic gate from Onsemi. Manufactured with precision and expertise, this high-quality component offers unparalleled reliability and performance. Ideal for a wide range of applications, from consumer electronics to industrial automation, this logic gate provides seamless integration and efficiency. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the N74F32D brings to your creations. Elevate your designs with this top-of-the-line logic gate today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the product.

No. of Functions: 4

Having 4 functions in one component reduces the need for multiple components, saving space and simplifying the design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with most electronic circuits and systems.

Propagation Delay (tpd): 6.6 ns

The low propagation delay ensures fast response times, making it suitable for applications requiring quick signal processing.

Technology: TTL

TTL technology offers high-speed operation and compatibility with other TTL devices, making it a reliable choice for digital logic applications.

Technical Specifications

Logic Gates N74F32D attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

15.5 mA

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

N74F32D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-415-3692, 5962014153692

NIIN

014153692

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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