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N74F3037D-T

NXP Semiconductors

N74F3037D-T by NXP Semiconductors

N74F3037D-T by NXP Semiconductors is a TTL NAND gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V and has a propagation delay of 5.5ns. This logic gate is commonly used in commercial applications requiring fast signal processing.

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Lifecycle Status

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4

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1k+

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Anansix

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Digiode

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 770 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 535 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

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Aranea Global

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Corphita

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Overview

Looking for high-quality logic gates? Look no further than the N74F3037D-T by NXP Semiconductors. With a reputation for excellence, NXP Semiconductors delivers reliable and durable products. The N74F3037D-T is perfect for a variety of applications, offering customers exceptional value, benefits, and advantages. Its compact size and surface mount design make it ideal for space-constrained projects. Experience fast propagation delay and a wide temperature range, ensuring optimal performance in any environment. Trust NXP Semiconductors to provide you with top-notch solutions for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable material for package body which ensures long term reliability and protection for internal components.

Surface Mount: YES

Can be easily mounted on PCBs, saving space and making it suitable for compact electronic devices.

No. of Functions: 4

Can perform multiple logic functions in a single integrated circuit, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level commonly used in electronic circuits, making it compatible with various systems.

Propagation Delay (tpd): 5.5 ns

Low propagation delay ensures fast response time, critical for time-sensitive applications.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating temperatures, ensuring reliable performance in typical environments.

Technology: TTL

Uses TTL technology known for its high-speed operation and robustness, ideal for digital logic applications.

Technical Specifications

Logic Gates N74F3037D-T attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Additional Features:

IOL = 160MA @ VOL = 0.5V; IOH = 67MA @ VOH = 2V; DUAL CENTER PIN VCC AND GND

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F3037D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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