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N74F02D,602

NXP Semiconductors

N74F02D,602 by NXP Semiconductors

NXP Semiconductors' N74F02D,602 is a TTL logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V with a propagation delay of 6.5ns. This small outline package is ideal for commercial applications requiring fast signal processing in a compact form factor.

Median Price

$0.272

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,014 parts In-Stock

1+ parts

-

100+ parts

$0.283

1k+ parts

$0.235

10k+ parts

$0.210

12,014

-

$0.283

$0.235

$0.210

Verical

USA . 7,980 parts In-Stock

1+ parts

-

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$0.262

7,980

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-

-

$0.262

Distributors (In-Stock)

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Digiode

USA . 2,187 parts In-Stock

1+ parts

$0.113

100+ parts

-

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2,187

$0.113

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Vyrian

USA . 8,780 parts In-Stock

1+ parts

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8,780

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Anansix

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Corphita

USA . 4,698 parts In-Stock

1+ parts

$0.107

100+ parts

-

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-

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4,698

$0.107

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-

-

Microchip USA

USA . 356 parts In-Stock

1+ parts

$6.500

100+ parts

$6.500

1k+ parts

$6.500

10k+ parts

$6.500

356

$6.500

$6.500

$6.500

$6.500

AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$8.190

100+ parts

-

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868

$8.190

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.922

100+ parts

$15.399

1k+ parts

$13.876

10k+ parts

-

500

$16.922

$15.399

$13.876

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QUARKTWIN TECHNOLOGY LTD

USA . 27,395 parts In-Stock

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Continental Prestige Electronics

USA . 12,014 parts In-Stock

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$0.143

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12,014

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$0.143

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UNI Independent Distributors

Spain . 7,390 parts In-Stock

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7,390

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Overview

Elevate your next electronics project with the N74F02D,602 logic gate by NXP Semiconductors. Crafted with precision and expertise, this small outline package offers seamless integration into various applications. Whether you're designing circuits for consumer electronics or industrial automation, this versatile component ensures optimal performance and reliability. Experience the advantage of fast propagation delay, low power consumption, and compatibility with surface mount technology. Trust NXP Semiconductors to deliver top-quality components that elevate your projects to new heights. Unlock endless possibilities with the N74F02D,602 - the perfect choice for your next innovation.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient packaging and integration into different electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent access to memory locations, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, which is common in many electronic devices, ensuring compatibility.

No. of Terminals: 34

Having 34 terminals provides ample connectivity options for interfacing with other components in a circuit.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style offers compact size and high reliability for space-constrained applications.

Organization: 32KX8

Organized in a 32KX8 configuration, providing a good balance between memory capacity and data width for various applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and durability for long-term usage.

Terminal Position: DUAL

Dual terminal position allows for more robust connections and easier PCB layout.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, enhancing overall performance.

Parallel or Serial: PARALLEL

Parallel interface enables faster data transfer and efficient communication with the memory module.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and supports RoHS compliance.

No. of Words: 32768 words

With a capacity of 32768 words, this memory module can store a large amount of data for various applications.

Memory Width: 8

Memory width of 8 bits allows for efficient data handling and processing in parallel.

Memory Density: 262144 bit

High memory density of 262144 bits provides ample storage space for complex applications.

Memory IC Type: NON-VOLATILE SRAM MODULE

Being a non-volatile SRAM module ensures that data is retained even during power loss or system shutdown.

Maximum Access Time: 150 ns

Fast maximum access time of 150 ns ensures quick read/write operations, enhancing overall system performance.

Technical Specifications

Logic Gates N74F02D,602 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

13 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

N74F02D,602 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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