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MPC7410HX450LD

NXP Semiconductors

MPC7410HX450LD by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

MPC7410HX450LD by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,167 parts In-Stock

1+ parts

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2,167

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Digiode

USA . 2,026 parts In-Stock

1+ parts

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2,026

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Vyrian

USA . 1,906 parts In-Stock

1+ parts

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1,906

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 2,423 parts In-Stock

1+ parts

$31.000

100+ parts

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2,423

$31.000

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UNI Independent Distributors

Spain . 3,475 parts In-Stock

1+ parts

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3,475

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Corphita

USA . 73 parts In-Stock

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73

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Technical Specifications

Microprocessors MPC7410HX450LD attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Bit Size:

32

JESD-30 Code:

S-XBGA-B360

No. of Terminals:

360

Package Body Material:

CERAMIC

Package Code:

BGA

Package Equivalence Code:

BGA360,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Speed:

450 rpm

Sub-Category:

Microprocessors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

MPC7410HX450LD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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