Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
MICROPROCESSOR, RISC; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Format: FIXED POINT;
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
One Stop Electronics
$16.000
Corphita
UNI Independent Distributors
Kepictronics
Microprocessors MPC7410RX450PE attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Boundary Scan:
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JESD-30 Code:
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MPC7410RX450PE Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM2931Z-5.0G
Onsemi
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Siemens
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
First Components International
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
MCF54455VP266
NXP Semiconductors
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MPC860SRVR50D4
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50;
STM32MP131CAE3
STMicroelectronics
STM32MP131CAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT, automotive, and consumer electronics. With a wide address bus width of 26 bits and external data bus width of 16 bits, it offers high performance in a compact square package shape.
MCF5251CVM140R2
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CVRMIBA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
P1010NXE5HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
MCF5475ZP266
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MCF5270CVM150R2
NXP Semiconductors' MCF5270CVM150R2 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. Ideal for industrial applications, this CMOS technology-based chip has a low power mode and supports boundary scan testing.
AM5706BCBDJAS
Texas Instruments
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
CS80C286-16
Harris Semiconductor
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
MIMXRT1176AVM8A
NXP's MIMXRT1176AVM8A microprocessor features integrated cache, 48 MHz clock frequency, and 32 DMA channels. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and floating-point format support.
MPC5200CVR400BR2
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
MIMXRT1165DVM6A
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX31CVMN4C
The NXP Semiconductors MCIMX31CVMN4C microprocessor operates at 1.5V and 3.3V, with TIN SILVER COPPER terminal finish. It is a RISC-based MICROPROCESSOR compatible with I2C, SPI, UART, and USB buses. With 9 I/O lines, it finds applications in various embedded systems requiring high processing power and connectivity options.
ATSAMA5D35A-CUR
Microchip Technology
ATSAMA5D35A-CUR by Microchip Technology is a 32-bit microprocessor with 131072 RAM words and 48 MHz max clock frequency. Ideal for industrial applications, it features 39 DMA channels, low power mode, and boundary scan capability. With a package style of grid array and terminal finish of tin silver copper, this processor offers high performance in a compact form factor.
MCF5485CVR200
The NXP Semiconductors MCF5485CVR200 is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it ideal for industrial applications requiring high-speed processing in a compact square package.
SPC5200CBV400B
NXP Semiconductors' SPC5200CBV400B is a 32-bit microprocessor with integrated cache and a max clock frequency of 66 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
MCIMX535DVP1C2
MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
MCIMX6S1AVM08AB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
LS1012AXE7KKB
LS1012AXE7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. Ideal for industrial applications, it features low power mode and integrated cache, making it suitable for high-speed processing in compact devices.
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MPC7410HX500LE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.9 V;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B360;
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MPC7410RX550PE
MICROPROCESSOR, RISC; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Speed: 550 rpm;
MPC7410HX500LC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
MPC7410HX450LC
MPC7410HX500LD
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPC7410THX400LE
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B;
MPC7410HX450LD
MPC7410RX450NE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.9 V;
MPC7410RX400LX
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MPC7410HX450NE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
MPC7410RX500PE
MICROPROCESSOR, RISC; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Low Power Mode: NO;
MPC7410HX400NE
MICROPROCESSOR, RISC;
MPC7410HX400LD
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA360,19X19,50;
MPC7410HX400LC
MPC7410HX400LE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; Speed: 400 rpm;
MPC7410HX450LE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPC7410RX400NE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B360;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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