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MC56F83686VLK

NXP Semiconductors

MC56F83686VLK by NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;

Median Price

$5.966

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 580 parts In-Stock

1+ parts

$6.050

100+ parts

-

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580

$6.050

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Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.881

10k+ parts

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9,600

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-

$5.881

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,572 parts In-Stock

1+ parts

-

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4,572

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Flip Electronics

USA . 2,400 parts In-Stock

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2,400

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Digiode

USA . 1,569 parts In-Stock

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1,569

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Anansix

USA . 232 parts In-Stock

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232

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,042 parts In-Stock

1+ parts

$9.600

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1k+ parts

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1,042

$9.600

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Vigor

Singapore . 1,600 parts In-Stock

1+ parts

$11.514

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1,600

$11.514

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Microchip USA

USA . 2,845 parts In-Stock

1+ parts

$27.751

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2,845

$27.751

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One Stop Electronics

USA . 472 parts In-Stock

1+ parts

$32.000

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472

$32.000

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$58.824

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71

$58.824

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UNI Independent Distributors

Spain . 2,173 parts In-Stock

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2,173

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Corphita

USA . 652 parts In-Stock

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652

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Technical Specifications

Digital Signal Processors (DSPs) MC56F83686VLK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MC56F83686VLK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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