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MC33FS6520CAE

NXP Semiconductors

MC33FS6520CAE by NXP Semiconductors

CAN FD/LIN TRANSCEIVER; Moisture Sensitivity Level (MSL): 3; Screening Level: AEC-Q100; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

Median Price

$7.170

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 750 parts In-Stock

1+ parts

$5.551

100+ parts

$4.895

1k+ parts

$4.657

10k+ parts

-

750

$5.551

$4.895

$4.657

-

Newark

USA . 350 parts In-Stock

1+ parts

$6.500

100+ parts

$4.970

1k+ parts

$4.640

10k+ parts

-

350

$6.500

$4.970

$4.640

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$7.840

100+ parts

$5.600

1k+ parts

$5.100

10k+ parts

-

225

$7.840

$5.600

$5.100

-

DigiKey

USA . 250 parts In-Stock

1+ parts

$9.180

100+ parts

$6.052

1k+ parts

$5.488

10k+ parts

-

250

$9.180

$6.052

$5.488

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Flip Electronics (Authorized)

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,690 parts In-Stock

1+ parts

$5.453

100+ parts

-

1k+ parts

-

10k+ parts

-

1,690

$5.453

-

-

-

Vyrian

USA . 2,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

-

-

-

-

Anansix

USA . 986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

986

-

-

-

-

Flip Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,295 parts In-Stock

1+ parts

$5.166

100+ parts

-

1k+ parts

-

10k+ parts

-

2,295

$5.166

-

-

-

Microchip USA

USA . 2,082 parts In-Stock

1+ parts

$18.637

100+ parts

-

1k+ parts

-

10k+ parts

-

2,082

$18.637

-

-

-

Perfect Parts

USA . 3,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,371

-

-

-

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UNI Independent Distributors

Spain . 1,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,324

-

-

-

-

A-Z Elektronik GmbH

Germany . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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360

-

-

-

-

Technical Specifications

Network Interfaces MC33FS6520CAE attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Telecom IC Type:

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33FS6520CAE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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