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MC33665ATS4AE

NXP Semiconductors

MC33665ATS4AE by NXP Semiconductors

MC33665ATS4AE by NXP Semiconductors is a CAN FD transceiver with 10 Mbps data rate. Operating temperature range from -40 to 125 °C, suitable for automotive applications. Features 48 terminals in a square flatpack package for surface mount assembly.

Median Price

$6.310

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,043 parts In-Stock

1+ parts

$5.042

100+ parts

$4.406

1k+ parts

$4.100

10k+ parts

-

5,043

$5.042

$4.406

$4.100

-

Chip1Stop

Japan . 42 parts In-Stock

1+ parts

$7.280

100+ parts

$5.470

1k+ parts

$4.660

10k+ parts

$4.650

42

$7.280

$5.470

$4.660

$4.650

DigiKey

USA . 345 parts In-Stock

1+ parts

$9.340

100+ parts

$6.184

1k+ parts

$5.615

10k+ parts

-

345

$9.340

$6.184

$5.615

-

Mouser Electronics

USA . 691 parts In-Stock

1+ parts

$10.010

100+ parts

$6.630

1k+ parts

$5.410

10k+ parts

-

691

$10.010

$6.630

$5.410

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.042

10k+ parts

-

10,000

-

-

$5.042

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Avnet

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.339

10k+ parts

$5.112

750

-

-

$5.339

$5.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,267 parts In-Stock

1+ parts

$6.470

100+ parts

-

1k+ parts

-

10k+ parts

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3,267

$6.470

-

-

-

Maritex

Poland . 227 parts In-Stock

1+ parts

$17.810

100+ parts

$9.183

1k+ parts

$7.482

10k+ parts

-

227

$17.810

$9.183

$7.482

-

Vyrian

USA . 5,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,779

-

-

-

-

TME

Poland . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.951

10k+ parts

-

600

-

-

$7.951

-

Anansix

USA . 296 parts In-Stock

1+ parts

-

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296

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Nova Conductors

Japan . 50 parts In-Stock

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50

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 646 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

-

10k+ parts

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646

$4.660

-

-

-

Corphita

USA . 4,112 parts In-Stock

1+ parts

$6.129

100+ parts

-

1k+ parts

-

10k+ parts

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4,112

$6.129

-

-

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Microchip USA

USA . 1,784 parts In-Stock

1+ parts

$27.020

100+ parts

-

1k+ parts

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10k+ parts

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1,784

$27.020

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-

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Continental Prestige Electronics

USA . 4,581 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,581

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Argo Parts USA

USA . 4,484 parts In-Stock

1+ parts

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100+ parts

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4,484

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-

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UNI Independent Distributors

Spain . 978 parts In-Stock

1+ parts

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978

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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100

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-

-

-

Overview

Unlock the potential of your network interfaces with the MC33665ATS4AE by NXP Semiconductors. Designed with cutting-edge technology and high-quality materials, this CAN FD transceiver offers unparalleled reliability and performance. Ideal for automotive applications, this product ensures seamless communication and data transfer at an impressive 10 Mbps data rate. Trust NXP Semiconductors to provide you with the innovative solutions you need to stay ahead in today's fast-paced industry. Elevate your systems with the MC33665ATS4AE and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

No. of Terminals: 48

48 terminals provide ample connection points for various applications.

Package Style (Meter): FLATPACK

Flatpack package style offers easy integration and installation in metering applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures performance in extreme conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Terminal Position: QUAD

Quad terminal position provides stability and reliability in connections.

Maximum Time At Peak Reflow Temperature (s): 40

40 seconds at peak reflow temperature ensures proper soldering during installation.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder connections for durability.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and reliable connections.

Telecom IC Type: CAN FD TRANSCEIVER

CAN FD transceiver type ensures high-speed data transmission in telecom applications.

Data Rate: 10 Mbps

10 Mbps data rate provides fast and reliable communication capabilities.

Moisture Sensitivity Level (MSL): 3

MSL 3 offers protection against moisture exposure for increased product longevity.

Technical Specifications

Network Interfaces MC33665ATS4AE attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

10 Mbps

JESD-30 Code:

S-PQFP-G48

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC33665ATS4AE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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