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LPC55S16JBD100K

NXP Semiconductors

LPC55S16JBD100K by NXP Semiconductors

NXP Semiconductors' LPC55S16JBD100K microcontroller features a 32-bit Cortex-M33 CPU, 262144 ROM words, and 98304 RAM bytes. Ideal for applications requiring up to 10-Ch 16-Bit ADC channels, PWM channels, and connectivity options like I2C, CAN, SPI, UART, USART, and USB.

Median Price

$6.132

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 380 parts In-Stock

1+ parts

$7.800

100+ parts

$5.093

1k+ parts

$4.621

10k+ parts

$4.562

380

$7.800

$5.093

$4.621

$4.562

Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$7.800

100+ parts

$5.100

1k+ parts

$4.260

10k+ parts

-

130

$7.800

$5.100

$4.260

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Rochester

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

$3.200

10k+ parts

$3.010

2,700

-

$3.570

$3.200

$3.010

Verical

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

$4.463

1k+ parts

$4.000

10k+ parts

$3.763

1,800

-

$4.463

$4.000

$3.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,696 parts In-Stock

1+ parts

$3.772

100+ parts

-

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2,696

$3.772

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.520

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10

$5.520

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Vyrian

USA . 4,458 parts In-Stock

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4,458

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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Anansix

USA . 108 parts In-Stock

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108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,195 parts In-Stock

1+ parts

$3.370

100+ parts

$3.286

1k+ parts

$3.269

10k+ parts

-

1,195

$3.370

$3.286

$3.269

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Ampacity Inc.

Singapore . 824 parts In-Stock

1+ parts

$3.370

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824

$3.370

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Corphita

USA . 189 parts In-Stock

1+ parts

$3.573

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189

$3.573

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Component Stockers USA

USA . 953 parts In-Stock

1+ parts

$4.990

100+ parts

$4.690

1k+ parts

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953

$4.990

$4.690

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Continental Prestige Electronics

USA . 3,356 parts In-Stock

1+ parts

$5.520

100+ parts

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1k+ parts

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10k+ parts

$5.410

3,356

$5.520

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$5.410

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.520

100+ parts

$5.410

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500

$5.520

$5.410

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Microchip USA

USA . 4,135 parts In-Stock

1+ parts

$31.749

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4,135

$31.749

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Aztec Data Supply Inc.

USA . 2,655 parts In-Stock

1+ parts

$39.410

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2,655

$39.410

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Corohmni

South Africa . 71 parts In-Stock

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$54.490

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71

$54.490

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UNI Independent Distributors

Spain . 1,262 parts In-Stock

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1,262

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Infinite Electronics LLP (Excess)

. 454 parts In-Stock

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454

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GreenTree Electronics

Israel . 450 parts In-Stock

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450

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Argo Parts USA

USA . 104 parts In-Stock

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104

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Overview

Discover the LPC55S16JBD100K by NXP Semiconductors - a premium microcontroller designed for cutting-edge applications. With a state-of-the-art Cortex-M33 CPU family and an array of peripherals including BOD, PWM, RTC, and more, this device offers unparalleled performance and versatility. From industrial automation to IoT devices, the LPC55S16JBD100K delivers seamless connectivity and efficient operation, making it the ideal choice for developers seeking reliability and innovation in their designs. Experience the next level of microcontroller technology with NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and compact mounting on circuit boards, saving space and enabling efficient PCB layout.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, allowing flexibility in power requirements for various applications.

Package Shape: SQUARE

Square package shape provides efficient use of board space and facilitates uniformity in design layout.

Bit Size: 32

32-bit architecture offers high processing power, enabling complex computations and faster execution of tasks.

No. of Terminals: 100

Ample number of terminals for connectivity options and interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch design enhances thermal performance and allows for denser packing of components on PCB.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables energy-efficient operation and compatibility with low-power devices.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliability in extreme conditions and industrial environments.

CPU Family: CORTEX-M33

Utilizes Cortex-M33 architecture for efficient processing, robust performance, and support for advanced features.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments and ensures system functionality in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish enhances solderability and conductivity, improving overall reliability and performance.

ADC Channels: YES

Integrated analog-to-digital converters enable precise measurement and monitoring of analog signals in the system.

DMA Channels: YES

Direct memory access channels facilitate efficient data transfer and reduce CPU load, enhancing system performance.

Terminal Position: QUAD

Quad terminal position simplifies component placement and soldering on the PCB, improving manufacturing efficiency.

ROM Words: 262144

Large ROM capacity for storing program code and data, allowing for complex algorithms and applications to be executed.

Width: 14 mm

Compact width dimensions for space-constrained designs and efficient integration into various electronic devices.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Diverse set of peripherals enhance functionality and versatility, providing additional features and capabilities to the microcontroller.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds and real-time operation, suitable for performance-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with short peak temperature duration ensures component reliability and integrity during manufacturing.

Peak Reflow Temperature °C: 260

Higher peak reflow temperature tolerance ensures robust solder joints and component durability in lead-free assembly processes.

Length: 14 mm

Compact length dimensions for space-saving designs and ease of integration in compact electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient instruction execution and high performance for various applications.

RAM Bytes: 98304

Large RAM capacity for data storage and processing, enabling efficient multitasking and real-time operation of the system.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and reliable electrical connections during device operation and assembly.

Analog To Digital Convertors: 10-Ch 16-Bit

Multiple 16-bit analog-to-digital converters allow for precise and simultaneous analog signal processing, suitable for sensor interfacing.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance and reliable operation of the microcontroller in various applications.

PWM Channels: YES

Support for pulse-width modulation channels enables precise control of analog outputs and power management in the system.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Versatile connectivity options for communication with external devices, networks, and peripherals, enabling seamless integration in diverse systems.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates, improving system reliability and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density mounting on PCBs, enabling compact and space-efficient electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring proper handling and storage to prevent component damage during assembly.

Speed: 150 rpm

High-speed processing capability for handling complex algorithms and real-time tasks efficiently in demanding applications.

On Chip Program ROM Width: 8

8-bit width of on-chip program ROM allows for efficient storage and execution of program instructions, enhancing system performance.

No. of I/O Lines: 64

Abundant I/O lines for interfacing with external devices and peripherals, enabling versatile connectivity and control in the system.

Technical Specifications

Microcontrollers LPC55S16JBD100K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC55S16JBD100K Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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