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LPC5536JBD64E

NXP Semiconductors

LPC5536JBD64E by NXP Semiconductors

NXP Semiconductors' LPC5536JBD64E microcontroller features a 32-bit CPU, 131072 bytes of RAM, and 262144 ROM words. With a max clock frequency of 32 MHz, it is ideal for applications requiring CAN connectivity, low power mode support, and multiple PWM channels.

Median Price

$8.300

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 130 parts In-Stock

1+ parts

$8.170

100+ parts

$4.790

1k+ parts

-

10k+ parts

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130

$8.170

$4.790

-

-

Arrow

USA . 48 parts In-Stock

1+ parts

$8.194

100+ parts

$5.099

1k+ parts

$4.730

10k+ parts

$4.634

48

$8.194

$5.099

$4.730

$4.634

DigiKey

USA . 788 parts In-Stock

1+ parts

$8.300

100+ parts

$5.959

1k+ parts

$5.003

10k+ parts

$4.909

788

$8.300

$5.959

$5.003

$4.909

Mouser Electronics

USA . 321 parts In-Stock

1+ parts

$8.300

100+ parts

$5.310

1k+ parts

$5.000

10k+ parts

$4.900

321

$8.300

$5.310

$5.000

$4.900

Newark

USA . 172 parts In-Stock

1+ parts

$8.370

100+ parts

$5.570

1k+ parts

$5.190

10k+ parts

-

172

$8.370

$5.570

$5.190

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Farnell

UK . 89 parts In-Stock

1+ parts

$9.690

100+ parts

$5.950

1k+ parts

$5.330

10k+ parts

-

89

$9.690

$5.950

$5.330

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Element14

Singapore . 89 parts In-Stock

1+ parts

$16.360

100+ parts

$10.640

1k+ parts

$9.540

10k+ parts

-

89

$16.360

$10.640

$9.540

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Verical

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.824

10k+ parts

-

640

-

-

$5.824

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Rochester

USA . 470 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$3.770

10k+ parts

$3.540

470

-

$4.210

$3.770

$3.540

Avnet

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

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320

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,578 parts In-Stock

1+ parts

$4.436

100+ parts

-

1k+ parts

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10k+ parts

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3,578

$4.436

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.103

100+ parts

-

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100

$7.103

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Vyrian

USA . 8,169 parts In-Stock

1+ parts

-

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8,169

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Anansix

USA . 345 parts In-Stock

1+ parts

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345

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$3.970

100+ parts

-

1k+ parts

-

10k+ parts

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150

$3.970

-

-

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Semicontronic

India . 87 parts In-Stock

1+ parts

$3.970

100+ parts

$3.871

1k+ parts

$3.851

10k+ parts

-

87

$3.970

$3.871

$3.851

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Corphita

USA . 2,644 parts In-Stock

1+ parts

$4.203

100+ parts

-

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10k+ parts

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2,644

$4.203

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Continental Prestige Electronics

USA . 125 parts In-Stock

1+ parts

$10.670

100+ parts

$6.580

1k+ parts

-

10k+ parts

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125

$10.670

$6.580

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Microchip USA

USA . 1,077 parts In-Stock

1+ parts

$32.648

100+ parts

-

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-

10k+ parts

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1,077

$32.648

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$69.776

100+ parts

$66.288

1k+ parts

$66.288

10k+ parts

-

3,000

$69.776

$66.288

$66.288

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Aztec Data Supply Inc.

USA . 2,055 parts In-Stock

1+ parts

$82.680

100+ parts

-

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-

10k+ parts

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2,055

$82.680

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Corohmni

South Africa . 186 parts In-Stock

1+ parts

$83.922

100+ parts

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186

$83.922

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Argo Parts USA

USA . 1,624 parts In-Stock

1+ parts

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1,624

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UNI Independent Distributors

Spain . 438 parts In-Stock

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438

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Glotronic Ltd.

UK . 384 parts In-Stock

1+ parts

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384

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$6.961

1k+ parts

$6.748

10k+ parts

$6.606

50

-

$6.961

$6.748

$6.606

Overview

Unlock the power of innovation with the LPC5536JBD64E by NXP Semiconductors. This cutting-edge microcontroller boasts top-tier quality and reliability, making it a standout choice for a wide range of applications. From IoT devices to industrial automation, this product offers unmatched value with its advanced features and seamless connectivity options. Experience the benefits of superior performance and efficiency, ensuring that your projects excel in today's fast-paced technological landscape. Elevate your designs with the LPC5536JBD64E and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-lasting performance.

Integrated Cache: YES

Allows for faster access to frequently used data, improving overall processing efficiency.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within the specified voltage limits.

On Chip Data RAM Width: 8

Offers a wider data path, allowing for quicker access to RAM and enhanced data processing capabilities.

Package Shape: SQUARE

Compact and space-efficient design that makes it easier to integrate into various electronic systems.

Bit Size: 32

Provides high computational power and supports a wide range of applications that require complex algorithms and processing.

DAC Channels: YES

Allows for analog output, enabling the microcontroller to interface with analog devices and sensors.

No. of Terminals: 64

Provides ample connectivity options for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.8 V

Supports a lower voltage range for power-efficient operations and battery-powered applications.

CPU Family: CORTEX-M33

Belonging to the Cortex-M family indicates high-performance and energy-efficient processing capabilities, suitable for embedded systems.

No. of External Interrupts: 8

Enables the microcontroller to respond quickly to external events, enhancing real-time processing capabilities.

Maximum Operating Temperature: 105 °C

Supports operation in a wide temperature range, making it suitable for industrial and automotive applications.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with various analog sensors and inputs.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, offloading the CPU and improving system performance.

Terminal Position: QUAD

Quad terminal position provides stability and robustness for reliable connections in different environments.

ROM Words: 262144

Ample ROM storage capacity for storing program instructions and data, supporting complex applications and algorithms.

Digital To Analog Convertors: 1-Ch 12-Bit

Precise digital-to-analog conversion for accurate control of analog systems and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and fast data processing, suitable for real-time applications.

No. of Timers: 6

Multiple timers support various timing functions and scheduling tasks, enhancing system functionality.

RAM Bytes: 131072

Generous RAM size for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull-wing terminals provide secure and reliable connections for stable operation in diverse environments.

Analog To Digital Convertors: 13-Ch 16-Bit

Multiple analog-to-digital channels with high resolution for accurate conversion of analog signals.

PWM Channels: YES

Pulse width modulation channels for precise control of digital signals, suitable for motor control and power management.

Connectivity: CAN, SERCOMM(8)

Supports various communication protocols for seamless connectivity with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy and rapid updates of firmware and software, ensuring adaptability to changing requirements.

Technical Specifications

Microcontrollers LPC5536JBD64E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

68

No. of External Interrupts:

8

No. of I/O Lines:

39

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, SERCOMM(8)

Peripherals:

BOD, COMPARATOR(4), POR, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

13-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

LPC5536JBD64E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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