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LPC5512JBD100E

NXP Semiconductors

LPC5512JBD100E by NXP Semiconductors

NXP Semiconductors' LPC5512JBD100E is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 32 MHz. It features 10-Ch 16-Bit ADCs and DMA channels, suitable for applications requiring BOD, CRC, PWM, RTC, and more peripherals. Ideal for low-profile designs with a wide supply voltage range from 1.8V to 3.6V.

Median Price

$4.955

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 10 parts In-Stock

1+ parts

$2.340

100+ parts

$2.260

1k+ parts

$2.170

10k+ parts

-

10

$2.340

$2.260

$2.170

-

Chip1Stop

Japan . 90 parts In-Stock

1+ parts

$4.950

100+ parts

$3.130

1k+ parts

$2.650

10k+ parts

$2.630

90

$4.950

$3.130

$2.650

$2.630

Mouser Electronics

USA . 134 parts In-Stock

1+ parts

$4.960

100+ parts

$3.170

1k+ parts

$2.820

10k+ parts

$2.740

134

$4.960

$3.170

$2.820

$2.740

DigiKey

USA . 90 parts In-Stock

1+ parts

$4.960

100+ parts

$3.171

1k+ parts

$2.824

10k+ parts

$2.744

90

$4.960

$3.171

$2.824

$2.744

Element14

Singapore . 80 parts In-Stock

1+ parts

$8.690

100+ parts

$5.570

1k+ parts

$4.600

10k+ parts

$4.570

80

$8.690

$5.570

$4.600

$4.570

Flip Electronics (Authorized)

USA . 2,472 parts In-Stock

1+ parts

-

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2,472

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Verical

USA . 2,352 parts In-Stock

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$3.290

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2,352

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$3.290

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Avnet

USA . 360 parts In-Stock

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360

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Distributors (In-Stock)

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Digiode

USA . 2,211 parts In-Stock

1+ parts

$3.088

100+ parts

-

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2,211

$3.088

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Nova Conductors

Japan . 56 parts In-Stock

1+ parts

$4.080

100+ parts

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56

$4.080

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Flip Electronics

USA . 10,752 parts In-Stock

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Vyrian

USA . 2,110 parts In-Stock

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Anansix

USA . 274 parts In-Stock

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274

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IBS Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2.964

1k+ parts

$2.847

10k+ parts

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10

-

$2.964

$2.847

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 355 parts In-Stock

1+ parts

$2.760

100+ parts

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355

$2.760

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Semicontronic

India . 355 parts In-Stock

1+ parts

$2.760

100+ parts

$2.691

1k+ parts

$2.677

10k+ parts

-

355

$2.760

$2.691

$2.677

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Corphita

USA . 211 parts In-Stock

1+ parts

$2.925

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211

$2.925

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Microchip USA

USA . 1,431 parts In-Stock

1+ parts

$19.152

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1,431

$19.152

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Aztec Data Supply Inc.

USA . 3,202 parts In-Stock

1+ parts

$41.290

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3,202

$41.290

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Corohmni

South Africa . 177 parts In-Stock

1+ parts

$56.118

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$56.118

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Lixinc

USA . 7,702 parts In-Stock

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7,702

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UNI Independent Distributors

Spain . 5,821 parts In-Stock

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Argo Parts USA

USA . 4,466 parts In-Stock

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Continental Prestige Electronics

USA . 4,172 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$3.998

1k+ parts

$3.876

10k+ parts

$3.794

1,000

-

$3.998

$3.876

$3.794

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Revolutionize your electronic designs with the LPC5512JBD100E by NXP Semiconductors, offering unparalleled quality and reliability in the microcontroller category. With advanced features like ADC and DMA channels, along with a maximum clock frequency of 32 MHz, this powerful device ensures optimal performance for a wide range of applications. From IoT devices to industrial automation, unlock endless possibilities and streamline your projects with the LPC5512JBD100E. Experience the value and benefits that NXP Semiconductors brings to the table with this cutting-edge microcontroller.

Feature Benefit Bullets

Surface Mount: YES

SMT technology allows for compact and efficient PCB design, making it easier for manufacturers to integrate this microcontroller into their devices.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V provides flexibility in power supply options for various applications.

Package Shape: SQUARE

Square package shape allows for easier placement and soldering on the PCB, ensuring a reliable connection.

Bit Size: 32

32-bit architecture provides enhanced performance and processing capabilities for complex applications.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity options and integration with external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving advantages and improved signal integrity.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8 V enables low-power operation and energy-efficient designs.

Maximum Operating Temperature: 105 °C

Wide operating temperature range of up to 105°C allows for reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M33

Based on the ARM Cortex-M33 architecture, offering high-performance computing capabilities for demanding applications.

Minimum Operating Temperature: -40 °C

Operational down to -40°C, making it suitable for industrial and automotive applications requiring extended temperature range.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and reliable electrical connections on the PCB.

ADC Channels: YES

Integrated Analog to Digital Converters provide the ability to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU overhead for faster and more efficient operation.

Terminal Position: QUAD

Quad terminal position offers improved mechanical stability and ease of soldering during PCB assembly.

ROM Words: 65536

Ample ROM storage of 65,536 words allows for storing program code and firmware for executing various functions and tasks.

Width: 14 mm

Compact 14 mm width enables space-efficient PCB layout and integration into small form factor devices.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Numerous built-in peripherals offer enhanced functionality and features for a wide range of applications, reducing external component count.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast processing and real-time response in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum reflow temperature duration of 30 seconds ensures reliable solder joints during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for lead-free soldering processes compliant with RoHS regulations.

Length: 14 mm

Compact 14 mm length ensures space-saving integration in compact devices and PCB designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with Reduced Instruction Set Computing (RISC) offers optimized performance and power efficiency.

RAM Bytes: 49152

Generous RAM capacity of 49,152 bytes enables efficient data storage and manipulation during program execution.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical attachment to the PCB, ensuring reliable electrical connections.

Analog To Digital Convertors: 10-Ch 16-Bit

10-channel 16-bit ADCs offer high-resolution analog signal conversion for accurate sensor interfacing and measurement.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3 V ensures consistent and reliable operation in a wide range of applications.

PWM Channels: YES

Support for Pulse Width Modulation channels enables precise control of analog output signals for motor control and lighting applications.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Versatile connectivity options including I2C, I2S, CAN, SPI, UART, USART, and USB provide seamless integration with external devices and peripherals.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization, enhancing the flexibility and longevity of the device.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density PCB design and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates that the device can withstand reflow soldering processes without damage or degradation.

Speed: 150 rpm

Fast processing speed of 150 rpm ensures rapid execution of instructions and tasks for real-time applications.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits provides efficient storage and retrieval of program instructions for quick and responsive operation.

No. of I/O Lines: 64

64 I/O lines offer ample interfacing options for connecting external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LPC5512JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

49152

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC5512JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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