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LPC4350FET180,551

NXP Semiconductors

LPC4350FET180,551 by NXP Semiconductors

NXP Semiconductors' LPC4350FET180,551 is a 32-bit microcontroller with Cortex-M4 CPU family. It features 24-bit address bus width, 32-bit external data bus width, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$14.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 188 parts In-Stock

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$14.660

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$10.792

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$9.252

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Flip Electronics (Authorized)

USA . 24 parts In-Stock

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Digiode

USA . 2,344 parts In-Stock

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$9.728

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Vyrian

USA . 8,019 parts In-Stock

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Anansix

USA . 612 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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Vigor

Singapore . 103 parts In-Stock

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$6.460

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Corphita

USA . 4,970 parts In-Stock

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$9.216

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AZTECH Wire

Italy . 876 parts In-Stock

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$17.281

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Ampacity Inc.

Singapore . 93 parts In-Stock

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Corohmni

South Africa . 561 parts In-Stock

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$39.180

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Aztec Data Supply Inc.

USA . 342 parts In-Stock

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$66.079

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Continental Prestige Electronics

USA . 4,774 parts In-Stock

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Microchip USA

USA . 3,322 parts In-Stock

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Argo Parts USA

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Aranea Global

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UNI Independent Distributors

Spain . 130 parts In-Stock

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Overview

Unleash the power of innovation with the LPC4350FET180,551 microcontroller from NXP Semiconductors. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation systems, this microcontroller delivers seamless operation and optimized efficiency. Experience the value of superior quality and advanced features that only NXP Semiconductors can provide. Elevate your projects to new heights with the LPC4350FET180,551 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to integrate onto PCBs, saves space and simplifies assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power sources, flexible for different environments.

Address Bus Width: 24

Allows for efficient memory addressing, enhances overall processing speed.

Package Shape: SQUARE

Compact design, efficient use of board space and ease of placement.

Bit Size: 32

High processing capability, suitable for handling complex tasks and calculations.

DAC Channels: YES

Enables analog signal output, essential for many control and monitoring applications.

Power Supplies (V): 2.5/3.3

Compatible with common voltage standards, versatile for various systems.

No. of Terminals: 180

Sufficient connectivity options, supports multiple external peripherals and devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Advanced packaging for optimal signal performance and heat dissipation.

Minimum Supply Voltage: 2.2 V

Low power operation possible, helps in reducing energy consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial and harsh environments.

CPU Family: CORTEX-M4

Powerful processor architecture, efficient for handling complex algorithms and tasks.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without performance issues.

Terminal Finish: TIN SILVER COPPER

Reliable terminal connections, ensures long-term stability and signal integrity.

ADC Channels: YES

Enables analog signal input, crucial for sensor interfacing and data acquisition.

DMA Channels: YES

Supports direct memory access for efficient data transfer, enhances system performance.

Terminal Position: BOTTOM

Allows for easy PCB integration and component placement.

Maximum Seated Height: 1.2 mm

Low profile design, suitable for compact devices and space-constrained applications.

Width: 12 mm

Compact form factor, ideal for applications where size is a critical factor.

External Data Bus Width: 32

High bandwidth for data transfer, supports fast communication with external devices.

Maximum Clock Frequency: 25 MHz

High processing speed, suitable for real-time applications and fast response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process, reliable and durable connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering, suitable for lead-free assembly processes.

Length: 12 mm

Balanced dimensions, fits well within standard PCB sizes and layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments, ensures reliable performance in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced peripheral integration, improves system functionality and flexibility.

RAM Bytes: 270336

Ample memory capacity, supports multitasking and data storage needs.

Technology: CMOS

Low power consumption, suitable for battery-powered applications and energy-efficient systems.

Terminal Form: BALL

Reliable terminal connections, ensures secure and stable electrical connections.

Nominal Supply Voltage: 3.3 V

Standard voltage level, compatible with common power sources and peripherals.

PWM Channels: YES

Enables precise control of analog signals, essential for motor control and LED dimming.

ROM Programmability: FLASH

Flexible and fast program storage, allows for easy firmware updates and modifications.

Terminal Pitch: 0.8 mm

Standard pitch size, compatible with common PCB designs and assembly processes.

Moisture Sensitivity Level (MSL): 3

Ensures proper handling and storage requirements, reduces risk of moisture-related damage.

Speed: 180 rpm

High processing speed, suitable for real-time control and monitoring applications.

No. of I/O Lines: 118

Sufficient I/O options, enables versatile connectivity with external devices and components.

Technical Specifications

Microcontrollers LPC4350FET180,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B180

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

118

No. of Terminals:

180

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA180,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

270336

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LPC4350FET180,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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