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LPC4333JET256,551

NXP Semiconductors

LPC4333JET256,551 by NXP Semiconductors

NXP Semiconductors' LPC4333JET256,551 is a 32-bit microcontroller with Cortex-M4 CPU family. It features 24-bit address bus width, 32-bit external data bus width, and 164 I/O lines. Ideal for industrial applications requiring high-speed processing up to 25 MHz and extensive connectivity options with DAC and ADC channels.

Median Price

$15.079

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 5,321 parts In-Stock

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Digiode

USA . 3,118 parts In-Stock

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Anansix

USA . 2,283 parts In-Stock

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Flip Electronics

USA . 1,800 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 500 parts In-Stock

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Corohmni

South Africa . 4 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$15.701

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$14.916

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$14.916

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$14.916

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One Stop Electronics

USA . 1,050 parts In-Stock

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AZTECH Wire

Italy . 451 parts In-Stock

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Semicontronic

India . 853 parts In-Stock

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$20.475

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Aztec Data Supply Inc.

USA . 4,627 parts In-Stock

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$63.330

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QUARKTWIN TECHNOLOGY LTD

USA . 5,565 parts In-Stock

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Microchip USA

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Corphita

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Argo Parts USA

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UNI Independent Distributors

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Discover the LPC4333JET256,551 by NXP Semiconductors, a top-of-the-line microcontroller designed for seamless integration in a variety of applications. With cutting-edge technology and superior quality, NXP Semiconductors sets the standard in the industry. This powerful microcontroller is perfect for projects requiring high-performance, reliability, and efficiency. From IoT devices to industrial automation, the LPC4333JET256,551 offers unmatched value, providing customers with the competitive edge they need to succeed. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides strong protection for the microcontroller, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving time and effort in production processes.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power requirements and compatibility with different systems and environments.

Address Bus Width: 24

A wider address bus allows for enhanced memory addressing capabilities, enabling the handling of larger data sets and complex operations.

Package Shape: SQUARE

The square package shape offers efficient use of space on circuit boards, optimizing layout design and ensuring compact system integration.

Bit Size: 32

A 32-bit architecture provides higher processing power and performance compared to lower bit-size microcontrollers, making it suitable for demanding applications.

DAC Channels: YES

Digital-to-analog converter channels allow for precise analog signal generation, facilitating tasks such as audio processing and sensor interfacing.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility in system design and power optimization, catering to different voltage requirements.

No. of Terminals: 256

Having a higher number of terminals allows for more connectivity options and interfaces, enabling versatile and complex system configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array low profile package style offers efficient heat dissipation and space-saving benefits, ensuring optimal performance in compact designs.

Minimum Supply Voltage: 2.2 V

A low minimum supply voltage enables operation in low-power environments and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain stable performance in industrial settings.

CPU Family: CORTEX-M4

The Cortex-M4 architecture offers high efficiency and performance for embedded applications, making this microcontroller suitable for real-time processing tasks.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliable operation in extreme cold conditions, expanding the range of applications for this microcontroller.

Terminal Finish: TIN SILVER COPPER

The terminal finish material provides excellent conductivity and solderability, ensuring reliable connections and preventing corrosion over time.

ADC Channels: YES

Analog-to-digital converter channels enable accurate and precise conversion of analog signals to digital data, essential for sensor applications and measurement tasks.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU, enhancing overall system performance in data-intensive operations.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing, optimizing signal integrity and reducing electromagnetic interference in the system.

ROM Words: 524288

With a large ROM capacity, this microcontroller can store extensive program code and data, supporting complex algorithms and applications with ease.

Maximum Seated Height: 1.55 mm

A low seated height profile offers space-saving benefits and allows for compact system designs, especially in applications with tight layout constraints.

Width: 17 mm

The compact width dimension enables efficient placement on circuit boards and supports dense system integration, ideal for space-constrained designs.

External Data Bus Width: 32

A wide external data bus width facilitates high-speed data transfer and efficient communication with external devices, improving overall system performance.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency allows for fast processing and real-time operation, meeting the performance requirements of demanding embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this microcontroller is suitable for efficient and reliable surface mount soldering processes in production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stable solder joints and reliable connections during the assembly process, meeting industry standards.

Length: 17 mm

The compact length dimension enables space-efficient placement and layout design on circuit boards, contributing to optimized system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance across a wide range of operating temperatures, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design provide efficient processing and control capabilities, making this product ideal for embedded systems and IoT applications.

RAM Bytes: 139264

With a large RAM capacity, this microcontroller can handle complex data processing, multitasking, and buffering requirements effectively, supporting high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, contributing to energy-efficient and reliable operation of the microcontroller.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates automated assembly processes, ensuring reliable electrical contacts and consistent performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources and voltage levels, simplifying system integration and power management.

PWM Channels: YES

Pulse-width modulation channels enable precise control of power output, motor speed, and LED brightness, adding versatility and functionality to the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and modifications, enhancing the adaptability and longevity of the microcontroller-based systems.

Terminal Pitch: 1 mm

A 1mm terminal pitch provides optimal spacing for reliable solder connections and PCB layout design, ensuring signal integrity and ease of assembly.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity during storage and handling, requiring standard precautions to prevent moisture-related damage to the microcontroller.

Speed: 204 rpm

With a high processing speed of 204 rounds per minute, this microcontroller can efficiently execute instructions and algorithms, meeting high-performance computing needs.

No. of I/O Lines: 164

A high number of I/O lines provide ample connectivity options and interface capabilities, enabling versatile input/output configurations and flexibility in system design.

Technical Specifications

Microcontrollers LPC4333JET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC4333JET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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