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LPC4333JET100E

NXP Semiconductors

LPC4333JET100E by NXP Semiconductors

NXP Semiconductors' LPC4333JET100E microcontroller features a 32-bit Cortex-M4 CPU, 24-bit address bus width, and 32-bit external data bus width. With DAC and ADC channels, it's ideal for industrial applications requiring a peak clock frequency of 25 MHz. This thin-profile chip operates b/w -40°C to 85°C with a supply voltage range of 2.2V to 3.6V.

Median Price

$19.740

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 198 parts In-Stock

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$19.740

100+ parts

$13.616

1k+ parts

$12.757

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198

$19.740

$13.616

$12.757

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Mouser Electronics

USA . 12 parts In-Stock

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$21.270

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$14.520

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$13.440

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$21.270

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$13.440

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Verical

USA . 9,880 parts In-Stock

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$12.603

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Flip Electronics (Authorized)

USA . 479 parts In-Stock

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479

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Digiode

USA . 3,096 parts In-Stock

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$16.368

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Vyrian

USA . 7,307 parts In-Stock

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Anansix

USA . 1,026 parts In-Stock

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Flip Electronics

USA . 479 parts In-Stock

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Nova Conductors

Japan . 69 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 191 parts In-Stock

1+ parts

$14.500

100+ parts

$14.138

1k+ parts

$14.065

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$14.138

$14.065

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Ampacity Inc.

Singapore . 42 parts In-Stock

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$14.500

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Corphita

USA . 1,788 parts In-Stock

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$15.507

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Vigor

Singapore . 484 parts In-Stock

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$16.770

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Component Stockers USA

USA . 968 parts In-Stock

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$19.200

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$12.960

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968

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Microchip USA

USA . 1,937 parts In-Stock

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$46.780

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$45.970

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$45.560

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$45.150

1,937

$46.780

$45.970

$45.560

$45.150

Corohmni

South Africa . 29 parts In-Stock

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$64.850

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$64.958

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$61.710

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$61.710

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500

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$61.710

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Aztec Data Supply Inc.

USA . 705 parts In-Stock

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$76.170

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QUARKTWIN TECHNOLOGY LTD

USA . 22,406 parts In-Stock

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Continental Prestige Electronics

USA . 5,990 parts In-Stock

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UNI Independent Distributors

Spain . 4,547 parts In-Stock

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Argo Parts USA

USA . 277 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock endless possibilities with the LPC4333JET100E by NXP Semiconductors, a leading manufacturer in the microcontroller industry. This powerful yet compact device offers unparalleled performance and versatility for a wide range of applications. From IoT devices to industrial automation, this microcontroller provides seamless integration and reliable operation. Experience the ultimate value and benefits that come with choosing NXP Semiconductors for your next project. Choose quality, choose innovation, choose LPC4333JET100E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Ability to support a high supply voltage of 3.6V provides flexibility in power requirements for different applications.

Address Bus Width: 24

Having a wide address bus width of 24 ensures efficient memory addressing and management within the microcontroller.

Package Shape: SQUARE

Square package shape facilitates easier placement and orientation on the PCB, optimizing space utilization.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and instructions with higher precision and efficiency.

DAC Channels: YES

Integrated Digital-to-Analog Converter (DAC) channels allow for analog signal generation, expanding the range of possible applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply options at 2.5V and 3.3V ensures compatibility with different power sources and requirements.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high reliability, space efficiency, and ease of assembly.

Minimum Supply Voltage: 2.2 V

Capability to operate at a low minimum supply voltage of 2.2V conserves power and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

CPU Family: CORTEX-M4

Utilizing the Cortex-M4 CPU family provides high performance and efficiency for executing complex tasks effectively.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables operation in extreme cold environments without performance degradation.

ADC Channels: YES

Built-in Analog-to-Digital Converter (ADC) channels allow for precise digital conversion of analog signals for accurate sensor readings.

RAM Bytes: 139264

Generous RAM capacity of 139264 bytes provides sufficient memory for data storage and manipulation during operation.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient operation.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent power delivery for reliable performance.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware and software, enhancing flexibility and scalability.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection against moisture-related damage, ensuring long-term reliability.

No. of I/O Lines: 49

Having 49 input/output lines provides versatile connectivity and interfacing capabilities for interacting with external devices and peripherals.

Technical Specifications

Microcontrollers LPC4333JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4333JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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