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LPC4327JBD144E

NXP Semiconductors

LPC4327JBD144E by NXP Semiconductors

NXP Semiconductors' LPC4327JBD144E is a 32-bit microcontroller with Cortex-M4 CPU, offering 24-bit address bus width and 32-bit external data bus width. Ideal for industrial applications, it features DAC and ADC channels, along with PWM support. Operating at up to 25 MHz, this microcontroller has a max supply voltage of 3.6 V and operates in temperatures ranging from -40°C to 85°C.

Median Price

$17.634

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 113 parts In-Stock

1+ parts

$21.460

100+ parts

$15.256

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$13.931

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113

$21.460

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$13.931

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Verical

USA . 9,960 parts In-Stock

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$13.808

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$13.808

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Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

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$16.370

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600

$16.370

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Digiode

USA . 3,281 parts In-Stock

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$17.452

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Vyrian

USA . 12,445 parts In-Stock

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12,445

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Chip Stock

USA . 495 parts In-Stock

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495

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Flip Electronics

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300

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Anansix

USA . 155 parts In-Stock

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155

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$15.235

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564

$15.235

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Ampacity Inc.

Singapore . 97 parts In-Stock

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$15.610

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97

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Semicontronic

India . 97 parts In-Stock

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$15.610

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$15.220

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$15.142

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Continental Prestige Electronics

USA . 2,792 parts In-Stock

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$16.370

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$16.043

2,792

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$16.043

Netroflash

USA . 100 parts In-Stock

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$16.370

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$16.043

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$16.370

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Corphita

USA . 3,923 parts In-Stock

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$16.533

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Vigor

Singapore . 6,594 parts In-Stock

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$18.370

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Aztec Data Supply Inc.

USA . 3,330 parts In-Stock

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$49.680

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Microchip USA

USA . 1,841 parts In-Stock

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$51.244

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$54.130

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$51.423

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$51.423

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Corohmni

South Africa . 64 parts In-Stock

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$57.150

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Lixinc

USA . 5,935 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,167 parts In-Stock

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UNI Independent Distributors

Spain . 1,548 parts In-Stock

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Overview

Unlock the power of innovation with the LPC4327JBD144E by NXP Semiconductors, a cutting-edge microcontroller that offers unparalleled quality and reliability. This versatile device boasts a wide range of applications, from IoT to industrial automation, providing customers with endless possibilities for their projects. With advanced features like DAC and ADC channels, as well as DMA support, this microcontroller delivers exceptional performance and efficiency. Trust NXP Semiconductors to bring you the best in semiconductor technology, and take your designs to the next level with the LPC4327JBD144E.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and flexibility for various applications.

Surface Mount

YES - Enables easy and efficient installation on circuit boards.

Maximum Supply Voltage

3.6 V - Allows for compatibility with a wide range of power sources.

Address Bus Width

24 - Provides ample capacity for memory addressing in the system.

Package Shape

SQUARE - Offers a compact and efficient design for space-saving installations.

Bit Size

32 - Provides high processing power and performance capabilities.

DAC Channels

YES - Allows for precise analog signal outputs.

Power Supplies (V)

2.5/3.3 - Offers flexibility in power requirements for different applications.

No. of Terminals

144 - Provides versatile connectivity options for peripheral devices.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Ensures ease of installation and space efficiency.

Minimum Supply Voltage

2.2 V - Allows for operation with lower power sources.

Maximum Operating Temperature

85 °C - Ensures reliability and stability under various environmental conditions.

CPU Family

CORTEX-M4 - Represents a high-performance and efficient processor architecture.

Minimum Operating Temperature

40 °C - Ensures operation in extreme cold environments.

Terminal Finish

TIN - Provides corrosion resistance and durability for terminals.

ADC Channels

YES - Enables accurate analog signal conversion for input data.

DMA Channels

YES - Enhances data transfer efficiency and minimizes CPU load.

Terminal Position

QUAD - Offers multiple terminal orientations for convenient PCB layout.

ROM Words

1048576 - Provides large memory capacity for program storage.

Maximum Seated Height

1.6 mm - Allows for slim and compact designs.

Width

20 mm - Offers a balanced form factor for various application sizes.

External Data Bus Width

32 - Supports high-speed data transfer between components.

Maximum Clock Frequency

25 MHz - Enables fast processing and response times.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C

260 - Ensures reliable and secure solder joints.

Length

20 mm - Offers a square form factor for efficient PCB layout.

Temperature Grade

INDUSTRIAL - Suitable for operation in rugged industrial environments.

Peripheral IC Type

MICROCONTROLLER, RISC - Represents a versatile and efficient control unit.

RAM Bytes

139264 - Provides ample memory for data storage and processing.

Technology

CMOS - Offers low power consumption and high noise immunity.

Terminal Form

GULL WING - Provides secure and reliable connections to the PCB.

Nominal Supply Voltage

3.3 V - Standard voltage for compatibility with various systems.

PWM Channels

YES - Allows for precise control of analog signals.

ROM Programmability

FLASH - Enables flexible and easy programming of memory.

Terminal Pitch

0.5 mm - Offers a fine pitch for increased terminal density.

Moisture Sensitivity Level (MSL)

3 - Indicates moderate sensitivity to moisture exposure.

Speed

204 rpm - Offers fast processing speed for real-time applications.

No. of I/O Lines

83 - Provides ample input/output options for peripheral connections.

Technical Specifications

Microcontrollers LPC4327JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC4327JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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