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LPC4325JET100E

NXP Semiconductors

LPC4325JET100E by NXP Semiconductors

NXP Semiconductors' LPC4325JET100E microcontroller features a 32-bit Cortex-M4 CPU, 24-bit address bus, and 32-bit external data bus width. With DAC and ADC channels, it's ideal for industrial applications requiring a peak clock frequency of 25 MHz in a compact grid array package.

Median Price

$8.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 225 parts In-Stock

1+ parts

$8.310

100+ parts

$8.140

1k+ parts

$7.980

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225

$8.310

$8.140

$7.980

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Distributors (In-Stock)

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Nova Conductors

Japan . 28 parts In-Stock

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$10.499

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28

$10.499

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Digiode

USA . 3,730 parts In-Stock

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3,730

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Vyrian

USA . 2,305 parts In-Stock

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Anansix

USA . 923 parts In-Stock

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923

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Distributors (Availability)

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AZTECH Wire

Italy . 287 parts In-Stock

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$8.437

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287

$8.437

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Vigor

Singapore . 745 parts In-Stock

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$9.260

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745

$9.260

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Continental Prestige Electronics

USA . 2,852 parts In-Stock

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$10.499

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$10.289

2,852

$10.499

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$10.289

Ampacity Inc.

Singapore . 1,423 parts In-Stock

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$19.000

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$19.000

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One Stop Electronics

USA . 663 parts In-Stock

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$24.000

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Aztec Data Supply Inc.

USA . 832 parts In-Stock

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$33.503

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Corohmni

South Africa . 86 parts In-Stock

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$35.161

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Microchip USA

USA . 3,054 parts In-Stock

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$39.768

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Argo Parts USA

USA . 2,800 parts In-Stock

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UNI Independent Distributors

Spain . 1,071 parts In-Stock

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Kepictronics

USA . 745 parts In-Stock

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Corphita

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$10.289

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$9.974

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$9.764

50

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$10.289

$9.974

$9.764

Overview

The LPC4325JET100E by NXP Semiconductors is a game-changer in the world of microcontrollers. With cutting-edge technology and a reputation for quality, NXP Semiconductors delivers an exceptional product that exceeds expectations. This microcontroller opens up a world of possibilities, with applications across various industries. Customers can enjoy superior performance, reliability, and versatility with the LPC4325JET100E, making it the go-to choice for those seeking top-tier solutions. Experience the difference with NXP Semiconductors and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring its longevity and reliability.

Surface Mount: YES

Surface mount allows for easy and secure mounting on circuit boards, making the product suitable for automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of applications.

Address Bus Width: 24

A wider address bus allows for more memory addressing capabilities, enabling the microcontroller to handle larger datasets efficiently.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and performance, making the microcontroller suitable for demanding tasks.

DAC Channels: YES

The presence of DAC channels allows for analog signal output, making the microcontroller versatile for applications requiring analog output capabilities.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility and compatibility with various power sources, enhancing the product's usability.

No. of Terminals: 100

Having a high number of terminals facilitates connectivity and integration with external devices, expanding the microcontroller's interface capabilities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The package style with a grid array, thin profile, and fine pitch design enhances signal integrity, thermal performance, and overall reliability of the microcontroller.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage ensures operational efficiency even in low-power scenarios, making the microcontroller suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the microcontroller to function reliably in a wide range of environmental conditions.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers advanced processing capabilities, efficient power management, and a rich set of peripherals, making the microcontroller suitable for high-performance applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures the microcontroller's functionality even in extreme cold conditions, enhancing its versatility.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, broadening its compatibility with sensors and other analog devices.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer between peripherals and memory, enhancing the microcontroller's overall performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, ensuring easy integration of the microcontroller into the overall system design.

ROM Words: 786432

With a large ROM capacity, the microcontroller can store a significant amount of program data, enabling complex algorithms and applications to be executed efficiently.

Maximum Seated Height: 1.2 mm

The low maximum seated height of the package allows for compact and slim device designs, making the microcontroller ideal for space-constrained applications.

Width: 9 mm

The compact width of the microcontroller makes it suitable for small form factor devices, enabling integration into compact electronic systems.

External Data Bus Width: 32

A 32-bit external data bus width enhances data transfer speed and efficiency, allowing the microcontroller to handle large volumes of data with precision.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables swift and responsive processing operations, making the microcontroller well-suited for time-sensitive applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller's reliability during the soldering process, maintaining its electrical and mechanical integrity.

Length: 9 mm

The compact length of the microcontroller contributes to its overall small footprint, allowing for integration into space-limited designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller's reliability and performance in harsh operating conditions typically encountered in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instruction sets, improved code efficiency, and faster execution speeds, enhancing overall system performance.

RAM Bytes: 139264

With a large RAM capacity, the microcontroller can efficiently handle data processing and storage requirements, enabling the execution of complex algorithms and multitasking operations.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and dependable for various applications.

Terminal Form: BALL

Ball terminal form enables easy soldering and reliable connection with the PCB, ensuring secure electrical contacts for stable performance of the microcontroller.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage of 3.3 V ensures consistent and reliable operation of the microcontroller across a wide range of applications and conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and software, enabling the microcontroller to adapt to changing requirements and applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and saves PCB space, making the microcontroller suitable for compact and miniaturized device designs.

Moisture Sensitivity Level (MSL): 3

Having MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during reflow soldering, ensuring its reliability in manufacturing processes.

Speed: 204 rpm

With a high speed of 204 rpm, the microcontroller can swiftly process instructions and data, enhancing overall system performance and responsiveness.

No. of I/O Lines: 49

A high number of I/O lines provide versatile input and output options, allowing the microcontroller to interface with a wide range of external devices and sensors for diverse applications.

Technical Specifications

Microcontrollers LPC4325JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4325JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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