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LPC4322JBD144E

NXP Semiconductors

LPC4322JBD144E by NXP Semiconductors

NXP Semiconductors' LPC4322JBD144E microcontroller features a 32-bit CORTEX-M4 CPU with 24-bit address bus width and 32-bit external data bus width. With DAC, ADC, PWM channels, it's ideal for industrial applications requiring high-speed processing up to 25 MHz at temperatures ranging from -40°C to 85°C.

Median Price

$32.560

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 57 parts In-Stock

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$21.850

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$15.740

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$12.550

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$21.850

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DigiKey

USA . 657 parts In-Stock

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$32.560

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Flip Electronics (Authorized)

USA . 657 parts In-Stock

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657

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Verical

USA . 648 parts In-Stock

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$37.604

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Nova Conductors

Japan . 59 parts In-Stock

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$16.433

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Digiode

USA . 3,438 parts In-Stock

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$17.936

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Flip Electronics

USA . 2,757 parts In-Stock

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Vyrian

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Anansix

USA . 1,529 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

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$14.709

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Semicontronic

India . 359 parts In-Stock

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$16.050

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$15.649

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$15.568

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Vigor

Singapore . 51 parts In-Stock

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$16.190

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Continental Prestige Electronics

USA . 6,672 parts In-Stock

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$16.433

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$16.104

6,672

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$16.104

Netroflash

USA . 2,000 parts In-Stock

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$16.433

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$16.433

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Corohmni

South Africa . 357 parts In-Stock

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$16.928

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Corphita

USA . 4,094 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$17.436

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$16.564

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Ampacity Inc.

Singapore . 267 parts In-Stock

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$34.930

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Microchip USA

USA . 2,857 parts In-Stock

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$43.921

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Aztec Data Supply Inc.

USA . 114 parts In-Stock

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$79.040

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Argo Parts USA

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UNI Independent Distributors

Spain . 2,520 parts In-Stock

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Authorized Procurement Solutions

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XScomponents

USA . 660 parts In-Stock

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Perfect Parts

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Overview

Experience the cutting-edge technology of the LPC4322JBD144E microcontroller by NXP Semiconductors, a leader in semiconductor innovation. This versatile device offers high-quality performance and reliability for a wide range of applications. With its advanced features and impressive specifications, this microcontroller provides exceptional value and benefits to customers seeking top-tier solutions for their projects. Explore the advantages of the LPC4322JBD144E and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, making it convenient for electronic projects.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 24

The 24-bit address bus width enables efficient memory addressing, enhancing the performance of the microcontroller in data retrieval processes.

Package Shape: SQUARE

The square package shape makes it easy to mount and align the microcontroller on the PCB, simplifying the assembly process.

Bit Size: 32

The 32-bit size allows for fast and efficient processing of data, making this microcontroller suitable for high-performance applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals into analog outputs, expanding its functionality.

Power Supplies (V): 2.5/3.3

With multiple power supply options, this microcontroller can operate in various voltage environments, making it adaptable to different power sources.

No. of Terminals: 144

The large number of terminals provides ample connectivity options, allowing for the attachment of various external devices for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch offers compactness and space-saving features, ideal for applications with limited space constraints.

Technical Specifications

Microcontrollers LPC4322JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC4322JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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