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LPC4317JET100E

NXP Semiconductors

LPC4317JET100E by NXP Semiconductors

NXP Semiconductors' LPC4317JET100E is a 32-bit microcontroller with Cortex-M4 CPU, featuring 24-bit address bus width and 32-bit external data bus width. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max clock frequency of 25 MHz. With DAC and ADC channels, this microcontroller offers versatile performance in various electronic systems.

Median Price

$11.766

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 520 parts In-Stock

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$13.770

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520

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Verical

USA . 260 parts In-Stock

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$9.761

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260

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Nova Conductors

Japan . 71 parts In-Stock

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$13.587

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Vyrian

USA . 7,812 parts In-Stock

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Digiode

USA . 2,644 parts In-Stock

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Anansix

USA . 1,843 parts In-Stock

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Semicontronic

India . 279 parts In-Stock

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$8.300

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$8.092

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$8.051

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279

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$8.051

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Ampacity Inc.

Singapore . 205 parts In-Stock

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$8.300

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Continental Prestige Electronics

USA . 441 parts In-Stock

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$13.587

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$13.315

441

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AZTECH Wire

Italy . 711 parts In-Stock

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$13.708

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Vigor

Singapore . 3,229 parts In-Stock

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Aztec Data Supply Inc.

USA . 653 parts In-Stock

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Microchip USA

USA . 2,585 parts In-Stock

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Corohmni

South Africa . 497 parts In-Stock

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Corphita

USA . 4,037 parts In-Stock

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Argo Parts USA

USA . 2,890 parts In-Stock

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UNI Independent Distributors

Spain . 1,229 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$13.315

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$12.907

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$12.635

1,000

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$13.315

$12.907

$12.635

Overview

Experience unparalleled performance and reliability with the LPC4317JET100E by NXP Semiconductors, a leading manufacturer in the industry. This microcontroller offers endless possibilities in various applications thanks to its advanced features and exceptional quality. With a wide supply voltage range, multiple DAC and ADC channels, and high-speed clock frequency, this product delivers unmatched value and benefits to customers seeking top-notch performance in their projects. Trust NXP Semiconductors for cutting-edge solutions that push the boundaries of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, offering flexibility in power supply options for the device.

Address Bus Width: 24

Wide address bus width enables the microcontroller to access a large memory space, accommodating complex programs and data.

Package Shape: SQUARE

Square package shape facilitates easier integration and mounting on the PCB, optimizing space utilization.

Bit Size: 32

32-bit bit size provides enhanced processing capabilities and performance compared to lower bit architectures.

DAC Channels: YES

Presence of DAC channels allows the microcontroller to generate analog signals, expanding its range of applications.

Power Supplies (V): 2.5/3.3

Supports multiple power supply voltages, giving flexibility in power management and compatibility with various systems.

No. of Terminals: 100

Having a large number of terminals provides extensive connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Sophisticated package style with fine pitch and thin profile enhances heat dissipation and allows for efficient signal routing.

Minimum Supply Voltage: 2.2 V

Low minimum supply voltage ensures energy efficiency and operation in systems with lower power requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in industrial environments with varying temperature conditions.

CPU Family: CORTEX-M4

Incorporating the Cortex-M4 CPU family provides powerful processing capabilities and performance for demanding applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the microcontroller to function reliably in harsh cold environments.

ADC Channels: YES

Presence of ADC channels enables the microcontroller to convert analog signals to digital, crucial for sensing and data acquisition applications.

DMA Channels: YES

Support for DMA channels enhances data transfer speeds and offloads the CPU, improving overall system efficiency and performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, optimizing space and making the device easier to integrate into the system.

ROM Words: 1048576

Large ROM capacity allows for storing extensive program code and data, suitable for complex applications with high memory requirements.

Maximum Seated Height: 1.2 mm

Low maximum seated height minimizes the overall profile of the device, making it suitable for compact designs and space-constrained applications.

Width: 9 mm

Compact width size makes the microcontroller suitable for space-saving designs and applications with limited PCB real estate.

External Data Bus Width: 32

Wide external data bus width allows for efficient data transfer between the microcontroller and external memory devices, improving system performance.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast processing and response times, making the microcontroller suitable for high-speed applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during the PCB assembly process, especially in reflow soldering techniques.

Length: 9 mm

Compact length size contributes to a smaller overall footprint of the device, ideal for applications where space is a critical factor.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations and demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller peripheral integration provide efficient processing and control capabilities for a wide range of applications.

RAM Bytes: 139264

Ample RAM capacity supports data storage and processing requirements, enabling the microcontroller to handle complex tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and robust.

Terminal Form: BALL

Ball terminal form simplifies the soldering process during assembly, ensuring secure and reliable connections for enhanced performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V provides consistent power delivery for reliable operation and performance of the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, adaptation to changing requirements, and efficient code storage.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm facilitates high-density PCB designs and reliable connections, optimizing space utilization and signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard handling precautions during storage and assembly to maintain device reliability.

Speed: 204 rpm

High operating speed of 204 rotations per minute (rpm) caters to fast data processing and task execution, suitable for real-time applications.

No. of I/O Lines: 49

Abundant I/O lines provide extensive connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LPC4317JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4317JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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