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LPC4313JET100E

NXP Semiconductors

LPC4313JET100E by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE;

Median Price

$10.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 780 parts In-Stock

1+ parts

-

100+ parts

$10.070

1k+ parts

$9.010

10k+ parts

$8.480

780

-

$10.070

$9.010

$8.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,152 parts In-Stock

1+ parts

$9.662

100+ parts

-

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2,152

$9.662

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Vyrian

USA . 6,630 parts In-Stock

1+ parts

-

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6,630

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Flip Electronics

USA . 2,080 parts In-Stock

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2,080

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Anansix

USA . 677 parts In-Stock

1+ parts

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677

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 627 parts In-Stock

1+ parts

$8.640

100+ parts

-

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627

$8.640

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Corphita

USA . 4,403 parts In-Stock

1+ parts

$9.153

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4,403

$9.153

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AZTECH Wire

Italy . 1,078 parts In-Stock

1+ parts

$14.590

100+ parts

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1,078

$14.590

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Vigor

Singapore . 1,890 parts In-Stock

1+ parts

$15.161

100+ parts

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1,890

$15.161

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Microchip USA

USA . 2,110 parts In-Stock

1+ parts

$35.094

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2,110

$35.094

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Component Stockers USA

USA . 684 parts In-Stock

1+ parts

$114.890

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684

$114.890

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A-Z Elektronik GmbH

Germany . 5,324 parts In-Stock

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5,324

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Alle Elektronik GmbH

Germany . 3,549 parts In-Stock

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3,549

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UNI Independent Distributors

Spain . 2,606 parts In-Stock

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2,606

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Technical Specifications

Microcontrollers LPC4313JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4313JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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