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LPC4078FET208,551

NXP Semiconductors

LPC4078FET208,551 by NXP Semiconductors

LPC4078FET208,551 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports various connectivity options like CAN and USB. Ideal for industrial applications requiring robust performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,938 parts In-Stock

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Anansix

USA . 2,272 parts In-Stock

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2,272

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Digiode

USA . 191 parts In-Stock

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191

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Flip Electronics

USA . 94 parts In-Stock

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Vigor

Singapore . 542 parts In-Stock

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$7.600

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542

$7.600

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AZTECH Wire

Italy . 266 parts In-Stock

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$17.760

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One Stop Electronics

USA . 1,190 parts In-Stock

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$33.000

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Microchip USA

USA . 4,162 parts In-Stock

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$46.523

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UNI Independent Distributors

Spain . 3,610 parts In-Stock

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Corphita

USA . 2,639 parts In-Stock

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Overview

Unlock unparalleled performance with the LPC4078FET208,551 from NXP Semiconductors—a leader in microcontroller innovation. Designed for versatility, this robust chip excels in demanding applications, offering exceptional processing power and seamless connectivity options. Its industrial-grade reliability ensures peak performance in hostile environments, making it perfect for IoT devices, automotive systems, and more. Elevate your projects with a trusted partner that promises quality, efficiency, and longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protects the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs.

Maximum Supply Voltage: 3.6 V

This voltage level ensures compatibility with low-power circuits, enhancing energy efficiency.

Package Shape: SQUARE

The square shape optimizes the layout for PCB space, facilitating more efficient designs.

Bit Size: 32

A 32-bit architecture allows for handling larger data sizes and more complex processing.

DAC Channels: YES

Availability of DAC channels enables better sound quality and analog signal generation for various applications.

Power Supplies (V): 3.3

With a nominal supply voltage of 3.3 V, this microcontroller is adaptable for common digital systems.

No. of Terminals: 208

A high number of terminals provides ample connectivity options for various peripheral devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array packaging allows for effective heat dissipation and enhanced mechanical stability.

Minimum Supply Voltage: 2.4 V

The lower voltage range ensures it can operate in battery-powered applications, extending their longevity.

Maximum Operating Temperature: 85 °C

This high temperature threshold is ideal for industrial environments where temperature variations are common.

CPU Family: CORTEX-M4

Based on the Cortex-M4, it offers advanced performance and low power consumption benefits.

Minimum Operating Temperature: -40 °C

Operational capability in low temperatures makes it suitable for extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish enhances solderability and resistance to oxidation, ensuring reliable connections.

ADC Channels: YES

The inclusion of ADC channels allows for precise analog signal processing, making it versatile for diverse applications.

DMA Channels: YES

DMA channels help in efficient data transfer, alleviating CPU load and improving performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies board layout and mounting, enhancing design flexibility.

ROM Words: 524288

A large ROM capacity allows for extensive program storage, accommodating complex applications.

Digital To Analog Converters: 1-Ch 10-Bit

The presence of DACs enables generation of analog signals for audio or control applications.

Width: 15 mm

A compact width allows for space-efficient designs in embedded systems.

Data EEPROM Size: 4032

Sufficient EEPROM size facilitates storage of configuration or calibration data for various use cases.

Peripherals: BOD, COMPARATOR(2), DMA(8), POR, PWM(2), RTC, TIMER(5), WDT

An extensive range of integrated peripherals enhances functionality and reduces the need for additional components.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency allows for efficient processing of tasks and responsiveness in applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature rating ensures reliability and robust connections in assembled units.

Length: 15 mm

The compact length enhances flexibility in design, especially for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability under demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency, providing a robust foundation for processing tasks.

RAM Bytes: 98304

A significant RAM size allows for complex applications and multitasking capabilities, improving overall performance.

Terminal Form: BALL

Ball terminal form improves solder joint reliability and facilitates better thermal performance.

Analog To Digital Converters: 8-Ch 12-Bit

Multiple ADC channels with high resolution enable versatile signal processing in various applications.

Nominal Supply Voltage: 3.3 V

Optimized for common electronic standards, enhancing compatibility with other components.

PWM Channels: YES

PWM channels support various control applications, such as motor speed regulation and LED dimming.

Connectivity: CAN(2), ETHERNET, I2C(3), I2S, SSP(3), UART(5), USB

A wide range of connectivity options ensures versatility for various communication protocols and applications.

ROM Programmability: FLASH

The flash ROM allows for easy updates and upgrades of firmware, providing flexibility for evolving applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch facilitates a compact arrangement on PCBs, promoting efficient use of space.

Moisture Sensitivity Level (MSL): 2

An MSL of 2 indicates it can withstand moderate moisture levels, suitable for many operational environments.

Speed: 120 rpm

The specified speed may relate to a feature such as motor control, offering design flexibility in speed-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances data handling, making it efficient for the intended processing capabilities.

No. of I/O Lines: 165

A high number of I/O lines provides extensive interfacing options and increases the device's versatility.

Technical Specifications

Microcontrollers LPC4078FET208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

4032

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S, SSP(3), UART(5), USB

Peripherals:

BOD, COMPARATOR(2), DMA(8), POR, PWM(2), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC4078FET208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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