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LPC4078FBD100E

NXP Semiconductors

LPC4078FBD100E by NXP Semiconductors

NXP Semiconductors' LPC4078FBD100E is a 32-bit microcontroller with 3.6V max supply voltage, -40 to 85°C operating temp range, and 524288 ROM words. Ideal for applications requiring CAN, I2C, UART connectivity and featuring 8-Ch 12-Bit ADC channels, DMA support, and Cortex-M4 CPU family.

Median Price

$6.100

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$6.100

100+ parts

$5.980

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$5.860

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$5.860

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Flip Electronics (Authorized)

USA . 32 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 4,810 parts In-Stock

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$5.795

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$5.795

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Nova Conductors

Japan . 10 parts In-Stock

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$7.115

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Bristol Electronics

USA . 1 parts In-Stock

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$11.400

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Vyrian

USA . 5,069 parts In-Stock

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Chip Stock

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Anansix

USA . 318 parts In-Stock

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Cyclops Electronics Ltd

UK . 40 parts In-Stock

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Flip Electronics

USA . 32 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,192 parts In-Stock

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$5.490

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Vigor

Singapore . 1,180 parts In-Stock

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$6.800

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Aranea Global

USA . 1,000 parts In-Stock

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$6.972

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$6.693

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Ampacity Inc.

Singapore . 18 parts In-Stock

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$11.290

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AZTECH Wire

Italy . 517 parts In-Stock

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Microchip USA

USA . 1,280 parts In-Stock

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$40.365

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Aztec Data Supply Inc.

USA . 4,141 parts In-Stock

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$62.040

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Corohmni

South Africa . 61 parts In-Stock

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Perfect Parts

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Argo Parts USA

USA . 5,405 parts In-Stock

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UNI Independent Distributors

Spain . 1,685 parts In-Stock

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Overview

Discover the LPC4078FBD100E by NXP Semiconductors, a top-tier microcontroller that delivers exceptional performance and reliability. With cutting-edge technology from a reputable manufacturer, this product is ideal for a wide range of applications. From industrial automation to consumer electronics, the LPC4078FBD100E offers unmatched value and benefits to customers. Experience seamless connectivity, high-speed processing, and versatile features with this innovative microcontroller. Upgrade your projects today with the LPC4078FBD100E and unleash endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to assemble and integrate the microcontroller into electronic devices, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage, providing flexibility in power source selection for different applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board, maximizing component density.

Bit Size: 32

32-bit architecture enables the microcontroller to handle more complex calculations and processes compared to lower bit sizes.

DAC Channels: YES

Integrated DAC channels allow for analog signal generation, making it suitable for applications requiring precise control over analog outputs.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures a compact footprint on the PCB, ideal for space-constrained designs.

Minimum Supply Voltage: 2.4 V

Can operate at a low supply voltage, conserving power in energy-efficient applications.

Maximum Operating Temperature: 85 °C

Capable of operating reliably at high temperatures, suitable for industrial or automotive applications.

CPU Family: CORTEX-M4

The Cortex-M4 architecture offers high performance and efficiency, making it suitable for real-time processing tasks.

Minimum Operating Temperature: -40 °C

Operational in extremely cold environments, suitable for applications requiring robust performance in low temperatures.

Terminal Finish: TIN

Tin terminal finish provides good solderability, ensuring reliable connections during assembly.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals into digital data, essential for sensor interfacing and data acquisition applications.

DMA Channels: YES

Direct Memory Access (DMA) support allows for efficient data transfer between memory and peripherals without CPU intervention, improving system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and ensures proper alignment during PCB assembly.

ROM Words: 524288

Large ROM size accommodates extensive program storage, enabling the microcontroller to run complex software applications.

Digital To Analog Convertors: 1-Ch 10-Bit

The 10-bit DAC provides sufficient resolution for generating accurate analog signals, suitable for audio applications or motor control.

Width: 14 mm

Compact width allows for space-efficient placement on the circuit board, contributing to a streamlined PCB layout.

Data EEPROM Size: 4K

Integrated EEPROM with 4K of storage enables non-volatile data retention, useful for storing configuration parameters or calibration values.

Peripherals: BOD, COMPARATOR, DMA(8), POR, PWM(2), RTC, TIMER(4), WDT

A wide range of peripherals enhances the microcontroller's versatility and functionality, catering to diverse application requirements.

Maximum Clock Frequency: 25 MHz

Capable of operating at high clock speeds, facilitating rapid execution of instructions and real-time processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time ensures proper soldering and component reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the microcontroller can withstand the thermal stresses of soldering processes.

Length: 14 mm

Compact length contributes to a space-efficient design layout and simplifies integration into electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller employs a Reduced Instruction Set Computing (RISC) architecture, known for its efficiency and high performance in embedded systems.

RAM Bytes: 98304

Generous RAM capacity supports data storage and manipulation during program execution, enhancing the microcontroller's processing capabilities.

Analog To Digital Convertors: 8-Ch 12-Bit

The 12-bit ADC with 8 channels delivers precise conversion of analog signals to digital data, essential for sensor-based applications with multiple inputs.

Nominal Supply Voltage: 3.3 V

Stable 3.3V supply voltage ensures reliable and consistent operation across a wide range of applications and environments.

PWM Channels: YES

Integrated PWM channels enable the microcontroller to control analog outputs with pulse-width modulation, essential for motor speed control or LED dimming.

Connectivity: CAN(2), I2C(3), I2S, SSP(3), UART(4), USART

A variety of communication interfaces allow for seamless connectivity with external devices, expanding the microcontroller's compatibility and versatility.

ROM Programmability: FLASH

Flash ROM enables flexible program storage and updating, making it easy to reprogram the microcontroller in the field or during development.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting on the PCB, improving layout flexibility and reducing PCB footprint.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates good moisture resistance during storage and assembly, ensuring the microcontroller's reliability in various environmental conditions.

Speed: 120 rpm

Capable of processing data at high speeds, suitable for applications that require rapid response times and real-time data processing.

On Chip Program ROM Width: 8

8-bit wide program ROM allows for efficient data storage and retrieval, supporting the microcontroller's execution of complex software algorithms.

Technical Specifications

Microcontrollers LPC4078FBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

CAN(2), I2C(3), I2S, SSP(3), UART(4), USART

Peripherals:

BOD, COMPARATOR, DMA(8), POR, PWM(2), RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC4078FBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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