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LPC4076FBD144E

NXP Semiconductors

LPC4076FBD144E by NXP Semiconductors

LPC4076FBD144E by NXP is a versatile 32-bit microcontroller featuring 144 terminals, operating b/w -40 °C to 85 °C. It supports multiple connectivity options like CAN and USB, with integrated ADC/DAC channels for efficient data processing. Ideal for industrial applications, it operates at a max voltage of 3.6V.

Median Price

$9.361

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,960 parts In-Stock

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Rochester

USA . 624 parts In-Stock

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$9.020

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$8.070

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$7.590

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$7.590

DigiKey

USA . 624 parts In-Stock

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$11.860

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Avnet

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Digiode

USA . 2,350 parts In-Stock

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$7.856

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Vyrian

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Anansix

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DigiKey Marketplace

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Corphita

USA . 4,584 parts In-Stock

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$7.443

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Component Stockers USA

USA . 553 parts In-Stock

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$9.540

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$8.960

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Vigor

Singapore . 7,975 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Overview

Unlock unparalleled performance with the LPC4076FBD144E from NXP Semiconductors, a leader in innovative microcontroller solutions. This versatile 32-bit marvel offers exceptional power efficiency and integrated peripherals, making it ideal for a wide range of applications, from industrial automation to consumer electronics. Experience enhanced connectivity options and superior processing capabilities, ensuring your projects thrive with reliability and precision. Elevate your designs with the trusted quality of NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances reliability and minimizes costs.

Surface Mount: YES

Allows for a compact design and easy integration into modern electronics.

Maximum Supply Voltage: 3.6 V

Versatile operating range suitable for various power supply designs.

Package Shape: SQUARE

Optimizes space efficiency on PCB layouts.

Bit Size: 32

Provides enhanced processing power for complex applications.

DAC Channels: YES

Enables precise digital-to-analog conversion for high-fidelity signals.

Power Supplies (V): 3.3

Standard voltage further simplifies design and compatibility.

No. of Terminals: 144

Offers ample connection options for various integrated peripherals.

Package Style (Meter): FLATPACK

Facilitates better thermal performance and reduced height profile.

Minimum Supply Voltage: 2.4 V

Ensures compatibility with low-power applications and extends battery life.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments and applications.

CPU Family: CORTEX-M4

Provides advanced features and efficient performance for embedded systems.

Minimum Operating Temperature: -40 °C

Ideal for industrial and harsh environment applications.

Terminal Finish: TIN

Ensures good solderability for reliable connections.

ADC Channels: YES

Allows for multiple analog signals to be processed simultaneously.

DMA Channels: YES

Enhances data transfer efficiency without burdening the CPU.

Terminal Position: QUAD

Facilitates efficient PCB layout and routing.

ROM Words: 262144

Provides ample program storage for complex applications.

Digital To Analog Converters: 1-Ch 10-Bit

Allows for basic analog signal generation necessary for various applications.

Width: 20 mm

Standard width that fits well in diverse board designs.

Data EEPROM Size: 2048

Enables storage of small amounts of data for configuration and state.

Peripherals: BOD, COMPARATOR(2), DMA(8), POR, PWM(2), RTC, TIMER(5), WDT

Rich set of peripherals increases the versatility of the microcontroller.

Maximum Clock Frequency: 25 MHz

Offers sufficient processing speed for most embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Compatible with modern PCB assembly processes.

Peak Reflow Temperature °C: 260

Suitable for high-temperature soldering techniques.

Length: 20 mm

Maintains compact form factor suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

Built to withstand challenging environmental conditions, ensuring reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency in computations.

RAM Bytes: 81920

Generous RAM size supports complex algorithms and data processing.

Terminal Form: GULL WING

Simplifies assembly and provides better connection stability.

Analog To Digital Converters: 8-Ch 12-Bit

Supports simultaneous conversion of multiple analog inputs with high precision.

Nominal Supply Voltage: 3.3 V

Standardized voltage supports easier circuit design.

PWM Channels: YES

Facilitates control of motors and other devices requiring pulse width modulation.

Connectivity: CAN(2), ETHERNET, I2C(3), I2S, SSP(3), UART(5), USB

Versatile connectivity options enable communication with a wide range of devices.

ROM Programmability: FLASH

Allows for easy updates and modifications in application code.

Terminal Pitch: 0.5 mm

Fine pitch allows for more connections in a smaller footprint.

Moisture Sensitivity Level (MSL): 2

Indicates moderate sensitivity, suitable for various packaging and handling methods.

Speed: 120 rpm

Adequate speed for various applications requiring rotational motion.

On Chip Program ROM Width: 8

Standard ROM width facilitates programming and integration.

No. of I/O Lines: 109

A high number of I/O lines allows for extensive interfacing with devices.

Technical Specifications

Microcontrollers LPC4076FBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

109

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S, SSP(3), UART(5), USB

Peripherals:

BOD, COMPARATOR(2), DMA(8), POR, PWM(2), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC4076FBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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