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LPC1830FET256,551

NXP Semiconductors

LPC1830FET256,551 by NXP Semiconductors

LPC1830FET256,551 by NXP Semiconductors is a 32-bit microcontroller with 24-bit address bus width and Cortex-M3 CPU family. It operates b/w -40 to 85°C, has 164 I/O lines, and supports DAC, ADC, PWM channels for industrial applications requiring high-speed processing at up to 25 MHz clock frequency.

Median Price

$5.870

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,221 parts In-Stock

1+ parts

$5.870

100+ parts

$5.750

1k+ parts

$5.640

10k+ parts

-

9,221

$5.870

$5.750

$5.640

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Verical

USA . 9,990 parts In-Stock

1+ parts

-

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$8.369

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9,990

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$8.369

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Chip1Stop

Japan . 18 parts In-Stock

1+ parts

-

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$4.410

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18

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$4.410

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$7.030

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300

$7.030

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Chip Stock

USA . 102,000 parts In-Stock

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102,000

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Vyrian

USA . 6,986 parts In-Stock

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6,986

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Anansix

USA . 1,845 parts In-Stock

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1,845

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Digiode

USA . 1,309 parts In-Stock

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1,309

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Distributors (Availability)

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One Stop Electronics

USA . 805 parts In-Stock

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$1.000

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-

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805

$1.000

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Continental Prestige Electronics

USA . 4,744 parts In-Stock

1+ parts

$6.890

100+ parts

-

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$6.752

4,744

$6.890

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$6.752

Netroflash

USA . 100 parts In-Stock

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$7.030

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100

$7.030

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Ampacity Inc.

Singapore . 952 parts In-Stock

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$10.000

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952

$10.000

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Vigor

Singapore . 1 parts In-Stock

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$13.880

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1

$13.880

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AZTECH Wire

Italy . 265 parts In-Stock

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$17.409

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265

$17.409

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Aztec Data Supply Inc.

USA . 2,041 parts In-Stock

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$26.000

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2,041

$26.000

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Semicontronic

India . 1,057 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

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1,057

$26.000

$25.350

$25.220

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Lixinc

USA . 17,488 parts In-Stock

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Microchip USA

USA . 9,047 parts In-Stock

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UNI Independent Distributors

Spain . 5,242 parts In-Stock

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Argo Parts USA

USA . 4,028 parts In-Stock

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Corohmni

South Africa . 2,185 parts In-Stock

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Corphita

USA . 2,042 parts In-Stock

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2,042

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Overview

Discover the LPC1830FET256,551 by NXP Semiconductors, a top-quality microcontroller that offers unparalleled performance and reliability. With its advanced technology and versatile applications, this product is designed to meet the needs of a wide range of industries. From consumer electronics to industrial automation, this microcontroller provides value, benefits, and advantages that will take your projects to the next level. Trust in NXP Semiconductors for cutting-edge solutions that deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount option allows for easy installation and integration into a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, making it versatile for different voltage requirements.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing and data storage, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape optimizes space utilization on a circuit board, making this microcontroller a compact and efficient choice for designs with limited space.

Bit Size: 32

The 32-bit architecture provides enhanced speed and processing capabilities, making this microcontroller suitable for tasks that require high performance and efficiency.

DAC Channels: YES

The presence of DAC channels allows for analog signal conversion, making this microcontroller ideal for applications that require precise control over analog outputs.

Power Supplies (V): 2.5/3.3

The dual voltage power supply options provide flexibility in powering the microcontroller, accommodating different voltage requirements in a system.

No. of Terminals: 256

With a high number of terminals, this microcontroller offers ample connectivity options for interfacing with external devices, making it versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers space-saving and efficient thermal management advantages, making it an optimal choice for compact designs.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage ensures efficient operation even with limited power sources, making this microcontroller suitable for battery-powered applications.

Technical Specifications

Microcontrollers LPC1830FET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

204800

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC1830FET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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