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LPC1827JET100E

NXP Semiconductors

LPC1827JET100E by NXP Semiconductors

NXP Semiconductors' LPC1827JET100E is a 32-bit microcontroller with 1048576 ROM words, 139264 RAM bytes, and 49 I/O lines. Operating at up to 25 MHz, it suits industrial applications requiring a peak temperature of 260°C. The Cortex-M3 CPU family chip features ADC and DMA channels for efficient data processing.

Median Price

$9.950

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 305 parts In-Stock

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$7.470

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$7.320

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$7.170

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$7.470

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DigiKey

USA . 974 parts In-Stock

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$9.950

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Flip Electronics (Authorized)

USA . 974 parts In-Stock

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974

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Verical

USA . 952 parts In-Stock

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$11.508

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952

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Vyrian

USA . 3,144 parts In-Stock

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Flip Electronics

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Anansix

USA . 2,383 parts In-Stock

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Digiode

USA . 2,079 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vigor

Singapore . 1,500 parts In-Stock

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$8.320

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$8.320

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Semicontronic

India . 643 parts In-Stock

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$8.460

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$8.248

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$8.206

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Ampacity Inc.

Singapore . 454 parts In-Stock

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$8.460

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Modulus Dynamics

Lithuania . 3,271 parts In-Stock

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$10.447

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$10.447

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$10.447

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3,271

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Corohmni

South Africa . 112 parts In-Stock

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Microchip USA

USA . 2,065 parts In-Stock

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Continental Prestige Electronics

USA . 4,027 parts In-Stock

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Corphita

USA . 2,534 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

Spain . 1,051 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Discover the LPC1827JET100E by NXP Semiconductors, a top-tier microcontroller offering unparalleled performance and reliability. With cutting-edge technology and a wide range of applications, this product provides exceptional value to customers seeking high-quality solutions. From industrial automation to consumer electronics, the LPC1827JET100E delivers seamless functionality and efficiency. Trust in NXP Semiconductors for superior products that meet your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit architecture enables faster processing and more complex operations compared to lower-bit microcontrollers.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages gives versatility in system design and compatibility.

No. of Terminals: 100

Having 100 terminals provides a wide range of connectivity options for peripherals and external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style allows for high-density mounting and efficient PCB layout.

Minimum Supply Voltage: 2.2 V

Lower minimum supply voltage enables energy-efficient operation and extends battery life.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microcontroller can withstand high temperature environments.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and low power consumption for embedded applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extremely low temperatures down to -40°C, suitable for various industrial environments.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing and sensor interfacing without external components.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU load, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing of connections for easy integration.

ROM Words: 1048576

Large ROM capacity of 1,048,576 words allows for extensive program storage and firmware updates.

Width: 9 mm

Compact width of 9mm enables space-efficient placement on the PCB.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz supports fast and responsive real-time processing.

Peak Reflow Temperature °C: 260

Higher peak reflow temperature ensures reliable soldering during PCB assembly processes.

Length: 9 mm

Length of 9mm complements the compact design and space-saving features of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and dedicated peripheral ICs make the microcontroller ideal for embedded control applications.

RAM Bytes: 139264

Ample RAM capacity of 139,264 bytes allows for efficient data storage and processing in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates reliable solder connections and efficient PCB assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V provides consistent power delivery for optimal performance.

PWM Channels: YES

Presence of PWM channels allows for precise control of motors, actuators, and other devices requiring variable-speed operation.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization for evolving system requirements.

Terminal Pitch: 0.8 mm

Fine pitch terminal spacing of 0.8mm enables high-density PCB design and compact layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates enhanced moisture resistance during storage and handling, ensuring long-term reliability.

Speed: 180 rpm

Operating at a speed of 180 rpm, the microcontroller delivers fast and efficient processing performance.

No. of I/O Lines: 49

Having 49 I/O lines provides ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC1827JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC1827JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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