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LPC1825JBD144E

NXP Semiconductors

LPC1825JBD144E by NXP Semiconductors

LPC1825JBD144E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 144 terminals, and operates in -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications requiring robust performance. Its compact FLATPACK design ensures efficient surface mounting.

Median Price

$10.738

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,960 parts In-Stock

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$11.615

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DigiKey

USA . 576 parts In-Stock

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$9.860

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Flip Electronics (Authorized)

USA . 576 parts In-Stock

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Vyrian

USA . 3,965 parts In-Stock

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Digiode

USA . 1,277 parts In-Stock

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Flip Electronics

USA . 576 parts In-Stock

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Anansix

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Ampacity Inc.

Singapore . 545 parts In-Stock

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$8.380

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Vigor

Singapore . 2,616 parts In-Stock

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$15.304

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Microchip USA

USA . 2,846 parts In-Stock

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$41.940

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Component Stockers USA

USA . 663 parts In-Stock

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$139.060

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UNI Independent Distributors

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Corphita

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Overview

Unlock the potential of your projects with the LPC1825JBD144E from NXP Semiconductors—a trusted leader in innovative microcontroller solutions. Built for reliability and efficiency, this 32-bit powerhouse excels in industrial applications where quality meets performance. With a robust design that thrives in extreme temperatures, it offers seamless integration and versatility, empowering you to bring sophisticated designs to life while maximizing value and reducing time-to-market. Elevate your engineering with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, suitable for various environments.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, facilitating compact designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage supports a wide range of applications while ensuring reliability and safety.

Package Shape: SQUARE

The square package shape is advantageous for surface-mount processes, ensuring ease of placement and soldering.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and memory addressing capabilities, ideal for complex applications.

Power Supplies (V): 2.5/3.3

Dual supply voltage options enhance flexibility, allowing compatibility with various systems.

No. of Terminals: 144

A high number of terminals facilitates extensive connectivity and integration of peripherals.

Package Style (Meter): FLATPACK

Flatpack style contributes to excellent thermal performance and efficient use of space.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage supports lower power consumption, ideal for battery-operated applications.

Maximum Operating Temperature: 105 °C

High operating temperature tolerance (up to 105 °C) enables usage in harsher environments.

CPU Family: CORTEX-M3

The Cortex-M3 family offers excellent performance and low power consumption, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures (-40 °C) expands the range of potential applications, including industrial settings.

Terminal Finish: TIN

Tin terminal finish contributes to good solderability and a reliable electronic connection.

ADC Channels: YES

Integrated ADC channels enhance the product's capability to process analog signals, which is critical in many applications.

DMA Channels: YES

DMA channels allow for efficient data transfers without CPU intervention, improving system performance.

Terminal Position: QUAD

Quad terminal position enhances the product's mounting stability and electrical performance.

ROM Words: 786432

A significant amount of ROM is available for program storage, which is beneficial for complex applications.

Width: 20 mm

Standard dimensions of 20 mm make it suitable for a variety of PCB designs.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing speeds, thus improving overall system throughput.

Maximum Time At Peak Reflow Temperature (s): 30

Compatibility with reflow soldering processes ensures reliable assembly in mass production.

Peak Reflow Temperature °C: 260

High peak reflow temperature provides flexibility in manufacturing processes.

Length: 20 mm

The compact length of 20 mm makes it a versatile choice for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and reliability for harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers efficient performance with reduced instruction execution time.

RAM Bytes: 139264

The large RAM size supports complex calculations and data management in various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high density integration.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering, reducing assembly time and complexity.

Nominal Supply Voltage: 3.3 V

The nominal voltage is ideal for modern low-power applications and ensures compatibility with many components.

PWM Channels: YES

PWM channels enable efficient control of motors and various devices, enhancing functionality.

ROM Programmability: FLASH

Flash programmability allows for easy updates and customization, making it suitable for evolving projects.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for more compact designs, maximizing available PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, allowing for manageable handling and storage conditions.

Speed: 180 rpm

The supported speed rating indicates suitability for applications that require consistent and reliable operation.

No. of I/O Lines: 83

With 83 I/O lines, this MCU provides extensive interfacing capabilities for a diverse range of applications.

Technical Specifications

Microcontrollers LPC1825JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC1825JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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