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LPC1823JET100E

NXP Semiconductors

LPC1823JET100E by NXP Semiconductors

NXP Semiconductors' LPC1823JET100E is a 32-bit microcontroller with 524288 ROM words, 106496 RAM bytes, and 49 I/O lines. Operating at up to 25 MHz, it's ideal for industrial applications requiring a peak temperature of 260°C. With ADC and DMA channels, this Cortex-M3 CPU family device offers versatile performance in compact square packaging.

Median Price

$16.580

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 520 parts In-Stock

1+ parts

$16.580

100+ parts

$11.330

1k+ parts

$10.520

10k+ parts

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520

$16.580

$11.330

$10.520

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DigiKey

USA . 220 parts In-Stock

1+ parts

$16.580

100+ parts

$11.322

1k+ parts

$10.585

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220

$16.580

$11.322

$10.585

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Verical

USA . 9,880 parts In-Stock

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$10.410

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9,880

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$10.410

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Flip Electronics (Authorized)

USA . 249 parts In-Stock

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249

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Distributors (In-Stock)

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Digiode

USA . 479 parts In-Stock

1+ parts

$10.612

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479

$10.612

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Nova Conductors

Japan . 300 parts In-Stock

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$11.935

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$11.935

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Vyrian

USA . 3,147 parts In-Stock

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Anansix

USA . 2,084 parts In-Stock

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IBS Electronics

USA . 1,040 parts In-Stock

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$12.777

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1,040

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NAC Semi

USA . 520 parts In-Stock

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$12.000

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520

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$12.000

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Cyclops Electronics Ltd

UK . 260 parts In-Stock

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260

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Flip Electronics

USA . 249 parts In-Stock

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249

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Distributors (Availability)

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Ampacity Inc.

Singapore . 330 parts In-Stock

1+ parts

$9.490

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330

$9.490

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Semicontronic

India . 330 parts In-Stock

1+ parts

$9.490

100+ parts

$9.253

1k+ parts

$9.205

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330

$9.490

$9.253

$9.205

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Corphita

USA . 2,465 parts In-Stock

1+ parts

$10.053

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$10.053

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Continental Prestige Electronics

USA . 5,231 parts In-Stock

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$11.935

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$11.696

5,231

$11.935

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$11.696

Netroflash

USA . 50 parts In-Stock

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$11.935

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$11.338

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$11.100

50

$11.935

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$11.338

$11.100

Corohmni

South Africa . 719 parts In-Stock

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$11.936

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719

$11.936

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Aztec Data Supply Inc.

USA . 190 parts In-Stock

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$46.860

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190

$46.860

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Microchip USA

USA . 2,504 parts In-Stock

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$47.040

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Vigor

Singapore . 1,100 parts In-Stock

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$380.000

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Lixinc

USA . 6,518 parts In-Stock

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Argo Parts USA

USA . 4,317 parts In-Stock

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UNI Independent Distributors

Spain . 2,248 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 8 parts In-Stock

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Overview

Unleash the power of innovation with the LPC1823JET100E microcontroller from NXP Semiconductors. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers superior functionality and reliability. Experience seamless integration, enhanced efficiency, and endless possibilities with the LPC1823JET100E. Elevate your projects to new heights with NXP Semiconductors - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller.

Surface Mount: YES

Allows for easy installation and compact design.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Helps in easy placement on circuit boards.

Bit Size: 32

Offers high performance for processing data.

Power Supplies (V): 2.5/3.3

Compatibility with different power supply options.

No. of Terminals: 100

Offers ample connectivity options for peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high density mounting and reliable connections.

Minimum Supply Voltage: 2.2 V

Ensures proper functionality at lower power levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications with high temperatures.

CPU Family: CORTEX-M3

High-performance processor for efficient operations.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions.

ADC Channels: YES

Allows for analog signal processing.

DMA Channels: YES

Enhanced data transfer capabilities for efficiency.

Terminal Position: BOTTOM

Simplifies the connection layout on circuit boards.

ROM Words: 524288

Offers sufficient storage capacity for program memory.

Width: 9 mm

Compact size for integration in various devices.

Maximum Clock Frequency: 25 MHz

High-speed processing capability for quick operations.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 9 mm

Uniform dimensions for easy placement in designs.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Optimized for embedded systems and low power consumption.

RAM Bytes: 106496

Sufficient memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Provides reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Standard voltage for stable operation.

PWM Channels: YES

Enables precise control of connected devices.

ROM Programmability: FLASH

Allows for reprogramming of the memory for flexibility.

Terminal Pitch: 0.8 mm

Fine pitch for compact and reliable connections.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during handling.

Speed: 180 rpm

Fast processing speed for quick response times.

No. of I/O Lines: 49

Sufficient input/output options for connectivity.

Technical Specifications

Microcontrollers LPC1823JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC1823JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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