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LPC1823JBD144E

NXP Semiconductors

LPC1823JBD144E by NXP Semiconductors

LPC1823JBD144E by NXP Semiconductors is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 144 terminals, and operates in extreme temperatures from -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications. With a clock frequency of up to 25 MHz, it's perfect for efficient processing tasks.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 6,054 parts In-Stock

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Digiode

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Vigor

Singapore . 5,000 parts In-Stock

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AZTECH Wire

Italy . 242 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Overview

Unlock endless possibilities with the LPC1823JBD144E from NXP Semiconductors, a leading name in microcontrollers. Engineered for exceptional performance and reliability, this 32-bit powerhouse excels in diverse applications—from industrial automation to smart home devices. Experience seamless integration, low power consumption, and robust processing capabilities that enhance your projects' efficiency and longevity. Choose quality, choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures stability and protection against environmental factors, enhancing the product's reliability.

Surface Mount: YES

Surface mount technology allows for a compact design and enables high-density circuit board assembly.

Maximum Supply Voltage: 3.6 V

This voltage tolerance provides flexibility in power supply options while ensuring safe operation.

Package Shape: SQUARE

The square package shape simplifies PCB layout and optimizes space utilization.

Bit Size: 32

A 32-bit architecture offers enhanced processing capabilities, enabling efficient handling of complex tasks and algorithms.

Power Supplies (V): 2.5/3.3

Supports a wide range of supply voltages, making it suitable for various applications with different power requirements.

No. of Terminals: 144

A high number of terminals allows for extensive connectivity options, enabling easy integration with various peripherals.

Package Style (Meter): FLATPACK

The flatpack style provides a low-profile design, making it ideal for space-constrained applications.

Minimum Supply Voltage: 2.2 V

A low minimum supply voltage improves energy efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 105 °C

A high temperature tolerance ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M3

The ARM Cortex-M3 CPU family provides high performance and energy efficiency, optimizing processing power for embedded applications.

Minimum Operating Temperature: -40 °C

This wide temperature range is suitable for outdoor and harsh environments, ensuring reliable operation.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Inclusion of ADC channels enables analog signal processing, catering to applications that require real-time data monitoring.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and layout flexibility on the PCB.

ROM Words: 524288

An ample ROM size allows for complex program storage and larger applications to be executed seamlessly.

Width: 20 mm

A compact width makes this microcontroller suitable for space-restricted applications.

Maximum Clock Frequency: 25 MHz

A relatively high clock frequency ensures responsive and fast performance in time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification facilitates reliable soldering processes during manufacturing, contributing to product durability.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance indicates compatibility with modern assembly processes, ensuring manufacturing efficiency.

Length: 20 mm

A length of 20 mm allows this microcontroller to fit well on compact PCBs without compromising functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures consistent performance in challenging environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture improves processing efficiency, making this microcontroller a suitable choice for performance-critical tasks.

RAM Bytes: 106496

A significant amount of RAM supports data manipulation and faster execution of processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, which is advantageous for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing accuracy.

Nominal Supply Voltage: 3.3 V

This nominal voltage provides a balance between performance and power consumption, making it an efficient choice.

PWM Channels: YES

The inclusion of PWM channels enables precise control of motors and lights, enhancing its applicability in automation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updates, making it adaptable for various applications over time.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports finer circuit design, perfect for modern compact electronics.

Moisture Sensitivity Level (MSL): 3

A moderate moisture sensitivity level indicates that it can be handled with standard precautions during assembly.

Speed: 180 rpm

This speed specification is suitable for applications requiring moderate movement, making it versatile for various uses.

No. of I/O Lines: 83

A high number of I/O lines allows for numerous input/output operations, increasing the microcontroller's versatility.

Technical Specifications

Microcontrollers LPC1823JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC1823JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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