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LPC1822JBD144E

NXP Semiconductors

LPC1822JBD144E by NXP Semiconductors

LPC1822JBD144E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 144 terminals, and operates in extreme temps from -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact FLATPACK design ensures efficient surface mounting.

Median Price

$9.802

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,960 parts In-Stock

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Vyrian

USA . 7,487 parts In-Stock

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Digiode

USA . 3,290 parts In-Stock

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Chip Stock

USA . 2,700 parts In-Stock

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Anansix

USA . 2,048 parts In-Stock

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Flip Electronics

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AZTECH Wire

Italy . 571 parts In-Stock

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$11.370

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Vigor

Singapore . 2,378 parts In-Stock

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One Stop Electronics

USA . 660 parts In-Stock

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Microchip USA

USA . 1,169 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,218 parts In-Stock

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UNI Independent Distributors

Spain . 6,157 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 2,630 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Overview

Unlock innovation with the LPC1822JBD144E microcontroller from NXP Semiconductors, a trusted leader in high-performance solutions. Designed for versatility and reliability, this advanced 32-bit controller excels in industrial automation, automotive applications, and smart devices. Benefit from its robust temperature range and rich features like ADC and PWM channels, ensuring seamless integration into your projects. Experience unmatched quality and performance that drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring longevity in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient utilization of board space, making it suitable for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power systems, enhancing versatility.

Package Shape: SQUARE

Square packaging facilitates easy integration into circuit boards and enhances thermal management.

Bit Size: 32

A 32-bit architecture allows for efficient processing and handling of complex calculations, suitable for advanced applications.

Power Supplies (V): 2.5/3.3

Support for multiple supply voltages (2.5 V and 3.3 V) provides flexibility in power management, catering to varying system requirements.

No. of Terminals: 144

A large number of terminals enhances connectivity options, suitable for applications requiring extensive I/O interfacing.

Package Style (Meter): FLATPACK

Flatpack style allows for better alignment on PCBs and optimal performance in space-constrained designs.

Minimum Supply Voltage: 2.2 V

A low minimum supply voltage expands usability across various battery-powered and low-energy applications.

Maximum Operating Temperature: 105 °C

High temperature operation ensures reliability in harsh environments, ideal for industrial and automotive applications.

CPU Family: CORTEX-M3

Based on the efficient Cortex-M3 core, this microcontroller delivers high performance while maintaining low power consumption.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold makes this microcontroller suitable for outdoor and industrial applications.

Terminal Finish: TIN

Tin finish is known for its excellent solderability and corrosion resistance, enhancing reliability in connections.

ADC Channels: YES

Integrated analog-to-digital converters enable real-time data acquisition from analog sensors, enhancing functionality.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, reducing CPU workload and improving performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and greater board layout flexibility.

ROM Words: 524288

Ample ROM capacity enables storage of complex programs, making it suitable for sophisticated applications.

Width: 20 mm

A compact width ensures that the microcontroller can fit into smaller devices without sacrificing performance.

Maximum Clock Frequency: 25 MHz

A clock speed of 25 MHz supports efficient processing for a wide range of applications, balancing speed and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard PCB assembly processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates good thermal resilience, suitable for environments requiring robust manufacturing processes.

Length: 20 mm

The small length supports space-saving designs, making it a practical choice for compact devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability in demanding applications, suitable for critical systems.

Peripheral IC Type: MICROCONTROLLER, RISC

This indicates a reduced instruction set computing architecture, which enhances performance and efficiency for embedded applications.

RAM Bytes: 106496

Sufficient RAM size supports multitasking and complex application execution, enhancing overall system performance.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and ease of soldering, improving manufacturability.

Nominal Supply Voltage: 3.3 V

The nominal voltage of 3.3 V is standard in many digital systems, promoting wide compatibility and ease of integration.

PWM Channels: YES

Support for PWM channels allows for precise control of motors and other devices, enhancing functionality in various applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and modifications to firmware, enhancing product longevity and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for a high density of connections, useful in compact electronic systems.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 ensures that proper handling and storage are achievable, balancing moisture protection with manufacturability.

Speed: 180 rpm

Speed rating indicates capability in applications requiring fast operation, beneficial for real-time control systems.

No. of I/O Lines: 83

A high number of I/O lines provides versatility in interfacing with various peripherals, enhancing application possibilities.

Technical Specifications

Microcontrollers LPC1822JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC1822JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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