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LPC1815JET100E

NXP Semiconductors

LPC1815JET100E by NXP Semiconductors

LPC1815JET100E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in extreme temps from -40 °C to 105 °C. It includes ADC and DMA channels, making it ideal for industrial applications requiring efficient data processing. Its compact design with 100 terminals ensures versatile integration in various systems.

Median Price

$9.665

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

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$9.665

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Flip Electronics (Authorized)

USA . 1,458 parts In-Stock

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Vyrian

USA . 3,847 parts In-Stock

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Flip Electronics

USA . 3,018 parts In-Stock

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Digiode

USA . 1,777 parts In-Stock

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Anansix

USA . 565 parts In-Stock

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AZTECH Wire

Italy . 496 parts In-Stock

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$9.630

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496

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$46.896

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$42.675

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$38.455

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QUARKTWIN TECHNOLOGY LTD

USA . 23,995 parts In-Stock

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Vigor

Singapore . 9,627 parts In-Stock

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UNI Independent Distributors

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Microchip USA

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Corphita

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Overview

Unlock your project's potential with the LPC1815JET100E microcontroller from NXP Semiconductors. Renowned for their cutting-edge technology and industry-leading quality, NXP delivers a powerhouse that thrives in diverse applications—from industrial automation to smart devices. Benefit from its low power consumption, robust performance, and extensive I/O capabilities, ensuring your designs are not just efficient but also future-ready. Experience innovation and reliability in one compact package!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides reliable protection and insulation for the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern circuit boards.

Maximum Supply Voltage: 3.6 V

The reasonable maximum supply voltage enables the microcontroller to function efficiently within standard power requirements.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on PCBs and simplifies heat dissipation.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle more complex computations and larger data sets, making it suitable for a variety of applications.

Power Supplies (V): 2.5/3.3

Support for multiple voltage levels enhances compatibility with a wide range of power supply designs.

No. of Terminals: 100

A higher number of terminals provides more connectivity options, enabling integration with a variety of peripherals and sensors.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid arrays provide high density and excellent performance for modern applications, minimizing circuit board space.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage allows for greater flexibility in power management and battery-operated applications.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial applications and harsh environments.

CPU Family: CORTEX-M3

The ARM Cortex-M3 core is well-regarded for its efficiency and performance in embedded systems, optimizing power consumption and speed.

Minimum Operating Temperature: -40 °C

The broad temperature range enables the microcontroller to function reliably in extreme conditions, making it ideal for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's capability for analog signal processing, allowing it to interact seamlessly with sensors.

DMA Channels: YES

Direct Memory Access (DMA) increases data transfer efficiency, freeing up CPU resources for other tasks and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminals facilitate easier mounting and provide better thermal performance, contributing to overall reliability.

ROM Words: 786432

A substantial amount of ROM allows for complex program storage, enabling sophisticated application development.

Width: 9 mm

A compact width ensures the product can fit in space-constrained applications while still providing a robust functionality.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for efficient processing speeds, suitable for real-time applications.

Peak Reflow Temperature °C: 260

Supporting high peak reflow temperatures ensures compatibility with advanced soldering techniques, crucial for modern manufacturing processes.

Length: 9 mm

The compact length provides flexibility in design and allows for integration in tight spaces without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliability and durability, making this microcontroller suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it features a simplified instruction set allowing for faster processing and higher efficiency.

RAM Bytes: 139264

A significant amount of RAM supports complex operations and data storage, enhancing the microcontroller's performance in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this microcontroller ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form improves soldering reliability and enhances electrical performance, crucial for high-speed applications.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage provides a standard for ensuring stable operation in various applications.

PWM Channels: YES

Integrated PWM channels are essential for controlling motors, LEDs, and other devices, expanding the microcontroller's application scope.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring the microcontroller can adapt to changing requirements.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for high-density packaging, making it suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for flexible storage and handling while ensuring reliability.

Speed: 180 rpm

This speed rating suggests that the microcontroller can handle dynamic applications, especially in motor control contexts.

No. of I/O Lines: 49

A high number of I/O lines enables extensive interfacing with external components, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LPC1815JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC1815JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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