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LPC1812JBD144E

NXP Semiconductors

LPC1812JBD144E by NXP Semiconductors

LPC1812JBD144E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 144 terminals, and operates in extreme temps from -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in embedded systems.

Median Price

$10.782

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 16 parts In-Stock

1+ parts

$18.200

100+ parts

$14.100

1k+ parts

$11.500

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16

$18.200

$14.100

$11.500

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Verical

USA . 9,960 parts In-Stock

1+ parts

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$10.782

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9,960

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$10.782

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DigiKey

USA . 212 parts In-Stock

1+ parts

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$9.160

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212

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$9.160

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Flip Electronics (Authorized)

USA . 212 parts In-Stock

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212

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Distributors (In-Stock)

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Digiode

USA . 833 parts In-Stock

1+ parts

$15.903

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833

$15.903

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Vyrian

USA . 3,812 parts In-Stock

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3,812

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Anansix

USA . 1,524 parts In-Stock

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1,524

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Flip Electronics

USA . 692 parts In-Stock

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692

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Distributors (Availability)

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Vigor

Singapore . 9,882 parts In-Stock

1+ parts

$14.207

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9,882

$14.207

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Corphita

USA . 2,731 parts In-Stock

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$15.066

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2,731

$15.066

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Component Stockers USA

USA . 53 parts In-Stock

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$16.380

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53

$16.380

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Microchip USA

USA . 1,440 parts In-Stock

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$38.933

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$38.933

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UNI Independent Distributors

Spain . 3,994 parts In-Stock

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3,994

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock unparalleled performance with the LPC1812JBD144E microcontroller from NXP Semiconductors. Renowned for its exceptional quality and reliability, this powerhouse is perfect for a variety of applications, from industrial automation to consumer electronics. Benefit from its robust design, broad operating temperature range, and advanced peripherals, ensuring seamless integration and enhanced efficiency in your projects. Elevate your next innovation with NXP’s trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures that the microcontroller is resistant to environmental factors, enhancing longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs.

Maximum Supply Voltage: 3.6 V

The wide supply voltage range accommodates various power supply configurations, making the product versatile.

Package Shape: SQUARE

The square package shape is ideal for efficient heat dissipation and eases mounting on circuit boards.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and performance for complex applications.

Power Supplies (V): 2.5/3.3

Multiple power supply options improve compatibility with a variety of devices and power systems.

No. of Terminals: 144

A higher number of terminals allows for greater connectivity options and integration capabilities.

Package Style (Meter): FLATPACK

Flatpack design offers a lower profile, making it ideal for space-constrained applications.

Minimum Supply Voltage: 2.2 V

Lower minimum supply voltage increases flexibility in power management and extends battery life.

Maximum Operating Temperature: 105 °C

High operating temperature rating makes this microcontroller suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 core is optimized for performance and efficiency, ideal for cost-sensitive embedded applications.

Minimum Operating Temperature: -40 °C

Ability to operate at extreme temperatures ensures reliability in harsh environments.

Terminal Finish: TIN

Tin plating enhances solderability and provides excellent corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels make the microcontroller suitable for applications requiring analog signal processing.

DMA Channels: YES

DMA support allows for efficient data transfers without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning enhances the stability and integrity of connections on the circuit board.

ROM Words: 524288

Generous ROM size allows for storage of complex programs and firmware, enabling advanced functionality.

Width: 20 mm

Standard width makes it easy to integrate into various PCB designs without compatibility issues.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows for faster processing, improving the responsiveness of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Endurance to peak reflow time ensures compatibility with modern soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility supports long-term reliability during PCB assembly.

Length: 20 mm

Standard length is advantageous for fitting into established designs and layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, it is rugged enough for use in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and reduces power consumption, making it efficient for embedded systems.

RAM Bytes: 106496

Ample RAM size allows for efficient data handling and processing power for complex applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, ensuring strong electrical connections.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V helps in aligning with standard voltage levels in digital circuits.

PWM Channels: YES

PWM capability supports a wide range of applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing product lifecycle.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density designs, making it suitable for compact applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating provides a balance between handling and soldering capabilities, reducing the risk of failure.

Speed: 180 rpm

Speed specification indicates the microcontroller’s capability to manage dynamics and responses efficiently.

No. of I/O Lines: 83

A multitude of I/O lines enhances flexibility in interfacing with various peripherals and sensors.

Technical Specifications

Microcontrollers LPC1812JBD144E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC1812JBD144E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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