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LPC1787FBD208,551

NXP Semiconductors

LPC1787FBD208,551 by NXP Semiconductors

NXP Semiconductors' LPC1787FBD208,551 is a 32-bit microcontroller with Cortex-M3 CPU, 165 I/O lines, and 98304 bytes of RAM. It operates at a max clock frequency of 25 MHz and has DAC and ADC channels for versatile applications in industrial settings. With a package style of flatpack and low profile, it's suitable for various embedded systems requiring high-speed processing capabilities.

Median Price

$16.033

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 36 parts In-Stock

1+ parts

$13.739

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-

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36

$13.739

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Verical

USA . 36 parts In-Stock

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$13.739

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36

$13.739

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Chip1Stop

Japan . 36 parts In-Stock

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$18.327

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36

$18.327

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Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$21.710

100+ parts

$16.820

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$13.710

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101

$21.710

$16.820

$13.710

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Distributors (In-Stock)

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Digiode

USA . 2,710 parts In-Stock

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$9.700

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2,710

$9.700

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IBS Electronics

USA . 878 parts In-Stock

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$14.294

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$13.608

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878

$14.294

$13.608

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Nova Conductors

Japan . 900 parts In-Stock

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$15.140

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900

$15.140

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Vyrian

USA . 5,819 parts In-Stock

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NAC Semi

USA . 1,944 parts In-Stock

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$17.900

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$16.520

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$17.900

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$16.520

Anansix

USA . 1,270 parts In-Stock

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Flip Electronics

USA . 95 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 263 parts In-Stock

1+ parts

$8.680

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263

$8.680

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Semicontronic

India . 207 parts In-Stock

1+ parts

$8.680

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$8.463

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$8.420

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207

$8.680

$8.463

$8.420

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Corphita

USA . 4,654 parts In-Stock

1+ parts

$9.189

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4,654

$9.189

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AZTECH Wire

Italy . 660 parts In-Stock

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$11.444

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$11.444

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Corohmni

South Africa . 1,360 parts In-Stock

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$14.391

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$14.391

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$14.823

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$14.082

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$14.082

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40

$14.823

$14.082

$14.082

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Continental Prestige Electronics

USA . 555 parts In-Stock

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$15.140

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$14.837

555

$15.140

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$14.837

Aztec Data Supply Inc.

USA . 323 parts In-Stock

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$38.860

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323

$38.860

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Microchip USA

USA . 4,111 parts In-Stock

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$47.725

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UNI Independent Distributors

Spain . 3,871 parts In-Stock

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Argo Parts USA

USA . 3,414 parts In-Stock

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Lixinc

USA . 802 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$14.837

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$14.383

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$14.080

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$14.837

$14.383

$14.080

Perfect Parts

USA . 40 parts In-Stock

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Overview

Unlock the potential of your next project with the LPC1787FBD208,551 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microcontrollers that cater to a wide range of applications. From consumer electronics to industrial automation, this versatile product provides value, benefits, and advantages like no other. Trust NXP for reliable performance and innovation that exceeds expectations. Elevate your designs with the LPC1787FBD208,551 and experience seamless integration and unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it a suitable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly, saving time and costs during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 26

The wide address bus width allows for efficient data transfer and processing, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape makes it easy to design and integrate the microcontroller into different systems, offering flexibility in deployment.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and efficiency, making the microcontroller suitable for complex tasks.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate analog signals accurately, expanding its functionality.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with various components and systems, making it a reliable choice.

No. of Terminals: 208

With a high number of terminals, this microcontroller can support multiple connections and peripherals, offering scalability in designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact designs and efficient PCB layouts, optimizing space usage in applications.

Technical Specifications

Microcontrollers LPC1787FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC1787FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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