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LPC1786FBD208,551

NXP Semiconductors

LPC1786FBD208,551 by NXP Semiconductors

NXP Semiconductors LPC1786FBD208,551 is a 32-bit microcontroller with Cortex-M3 CPU family. It features 26-bit address bus width, 32-bit external data bus width, and 165 I/O lines. Ideal for industrial applications requiring high-speed processing at up to 25 MHz clock frequency.

Median Price

$14.490

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 33 parts In-Stock

1+ parts

$18.620

100+ parts

$13.536

1k+ parts

$12.001

10k+ parts

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33

$18.620

$13.536

$12.001

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Flip Electronics (Authorized)

USA . 1,620 parts In-Stock

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1,620

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Rochester

USA . 139 parts In-Stock

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$10.360

1k+ parts

$9.270

10k+ parts

$8.720

139

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$10.360

$9.270

$8.720

Distributors (In-Stock)

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Digiode

USA . 1,891 parts In-Stock

1+ parts

$9.928

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1,891

$9.928

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Nova Conductors

Japan . 51 parts In-Stock

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$14.020

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51

$14.020

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Vyrian

USA . 12,116 parts In-Stock

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Flip Electronics

USA . 6,264 parts In-Stock

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Anansix

USA . 1,171 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,160 parts In-Stock

1+ parts

$9.405

100+ parts

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3,160

$9.405

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Continental Prestige Electronics

USA . 1,255 parts In-Stock

1+ parts

$14.020

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$13.740

1,255

$14.020

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$13.740

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$14.020

100+ parts

-

1k+ parts

$13.319

10k+ parts

$13.039

1,000

$14.020

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$13.319

$13.039

Vigor

Singapore . 7 parts In-Stock

1+ parts

$15.020

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7

$15.020

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Semicontronic

India . 298 parts In-Stock

1+ parts

$19.330

100+ parts

$18.847

1k+ parts

$18.750

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298

$19.330

$18.847

$18.750

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Aztec Data Supply Inc.

USA . 128 parts In-Stock

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$46.440

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128

$46.440

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Microchip USA

USA . 2,433 parts In-Stock

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$53.424

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UNI Independent Distributors

Spain . 5,464 parts In-Stock

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Argo Parts USA

USA . 3,356 parts In-Stock

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Overview

Discover the LPC1786FBD208,551 by NXP Semiconductors, a top-tier microcontroller that guarantees exceptional performance and reliability. With a cutting-edge CORTEX-M3 CPU family and advanced features like DAC and ADC channels, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unparalleled value, efficiency, and precision. Trust NXP Semiconductors for quality products that push the boundaries of innovation and deliver superior results every time. Elevate your projects with the LPC1786FBD208,551 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for compact and robust applications.

Surface Mount: YES

Surface mount technology allows for easy assembly on circuit boards, making the integration of this microcontroller into electronic devices efficient.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources effectively.

Address Bus Width: 26

A wider address bus allows for efficient data management and address decoding, enhancing the overall processing speed of the microcontroller.

Package Shape: SQUARE

The square package shape makes the microcontroller easy to handle and place on a circuit board, optimizing space utilization in the design.

Bit Size: 32

A 32-bit architecture offers higher computational power and precision in processing data, making this microcontroller suitable for complex applications.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to generate analog signals accurately, enabling it to interface with a variety of sensors and devices.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V, this microcontroller is energy-efficient and compatible with standard power sources.

No. of Terminals: 208

Having a large number of terminals provides ample connectivity options for peripherals and external components, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style of flatpack, low profile, and fine pitch enables a compact design, making the microcontroller suitable for space-constrained applications.

Minimum Supply Voltage: 2.4 V

The ability to operate at a minimum supply voltage of 2.4V ensures the microcontroller remains functional even under low-power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions and extended operation.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 family, this microcontroller offers a balance between performance and power efficiency, making it an ideal choice for various embedded applications.

Minimum Operating Temperature: -40 °C

The microcontroller can function reliably even at extremely low temperatures, making it suitable for applications that require operation in cold environments.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable connection between the microcontroller and the PCB.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data accurately, expanding its capability to interface with various sensors and devices.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer between peripherals and memory, improving overall system performance and response time.

Terminal Position: QUAD

Quad terminal position enhances the stability and mechanical integrity of the microcontroller when mounted on a PCB, ensuring reliable operation over time.

ROM Words: 262144

With a large ROM capacity of 262144 words, the microcontroller can store a significant amount of program data and instructions, supporting complex applications.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm allows for a slim and compact overall system design when using this microcontroller, particularly beneficial for portable devices.

Width: 28 mm

The moderate width of 28mm makes the microcontroller suitable for various PCB layouts and form factors, offering flexibility in system design.

External Data Bus Width: 32

A wide external data bus width of 32 bits facilitates fast and efficient data transfer between the microcontroller and external memory or devices, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25MHz, this microcontroller offers high-speed processing capabilities, making it suitable for real-time applications that demand quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the microcontroller can undergo manufacturing processes such as reflow soldering without compromising its functionality.

Peak Reflow Temperature °C: 260

The microcontroller can withstand peak reflow temperatures of up to 260°C during assembly, ensuring proper soldering and assembly reliability.

Length: 28 mm

With a length of 28mm, the microcontroller's compact size allows for efficient use of space on a PCB while accommodating other components and circuitry.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller can operate reliably in harsh conditions and temperature ranges commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller belongs to the RISC architecture, offering high performance and efficiency in executing instructions, making it suitable for demanding applications.

RAM Bytes: 81920

With a large RAM capacity of 81920 bytes, the microcontroller can efficiently store and access temporary data during program execution, enhancing multitasking capabilities.

Technology: CMOS

Utilizing CMOS technology, the microcontroller offers low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring a secure connection between the microcontroller and the PCB.

Nominal Supply Voltage: 3.3 V

Operating at a stable nominal supply voltage of 3.3V, the microcontroller delivers consistent performance and power efficiency across different operating conditions.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise pulse-width modulation signals, suitable for controlling motors, LEDs, and other peripherals.

ROM Programmability: FLASH

Featuring Flash ROM programmability, the microcontroller allows for easy and quick firmware updates, enabling flexibility and adaptability in embedded system designs.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, the microcontroller enables high-density mounting on PCBs, saving space and allowing for more compact electronic devices.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that the microcontroller is pre-baked and suitable for standard soldering processes, ensuring reliability in manufacturing.

Speed: 120 rpm

The microcontroller operates at a speed of 120 revolutions per minute, suitable for controlling rotational devices and applications requiring precise speed control.

No. of I/O Lines: 165

With 165 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices, sensors, and peripherals, making it versatile for various applications.

Technical Specifications

Microcontrollers LPC1786FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

165

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC1786FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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