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LPC1776FET180,551

NXP Semiconductors

LPC1776FET180,551 by NXP Semiconductors

NXP Semiconductors' LPC1776FET180,551 is a 32-bit microcontroller with Cortex-M3 CPU, 20-bit address bus, and 16-bit external data bus. It operates at up to 25 MHz with 81920 bytes of RAM and 262144 ROM words. Ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels.

Median Price

$13.460

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 756 parts In-Stock

1+ parts

$11.119

100+ parts

$8.835

1k+ parts

$8.275

10k+ parts

$8.157

756

$11.119

$8.835

$8.275

$8.157

DigiKey

USA . 82 parts In-Stock

1+ parts

$15.800

100+ parts

$11.667

1k+ parts

$10.024

10k+ parts

-

82

$15.800

$11.667

$10.024

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EBV Elektronik

Germany . 756 parts In-Stock

1+ parts

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756

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$10.091

100+ parts

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200

$10.091

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Digiode

USA . 2,350 parts In-Stock

1+ parts

$10.563

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2,350

$10.563

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Martec Srl

Italy . 12,030 parts In-Stock

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12,030

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Bristol Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 7,173 parts In-Stock

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7,173

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Cyclops Electronics Ltd

UK . 4,376 parts In-Stock

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Anansix

USA . 647 parts In-Stock

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647

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

iBuyXS LLC

. 10,000 parts In-Stock

1+ parts

$7.750

100+ parts

-

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10,000

$7.750

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Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$8.210

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136

$8.210

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Corphita

USA . 4,994 parts In-Stock

1+ parts

$10.007

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4,994

$10.007

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AZTECH Wire

Italy . 695 parts In-Stock

1+ parts

$15.923

100+ parts

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695

$15.923

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Microchip USA

USA . 7,358 parts In-Stock

1+ parts

$44.604

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7,358

$44.604

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BidChips

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,165 parts In-Stock

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4,165

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GreenTree Electronics

Israel . 2,486 parts In-Stock

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2,486

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Perfect Parts

USA . 1,270 parts In-Stock

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1,270

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$9.889

1k+ parts

$9.586

10k+ parts

$9.385

1,000

-

$9.889

$9.586

$9.385

Futuretech Components

Singapore . 945 parts In-Stock

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945

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Overview

Unlock endless possibilities with the LPC1776FET180,551 microcontroller by NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers unmatched performance in the field of microcontrollers. From industrial automation to consumer electronics, this versatile microcontroller offers seamless integration and unparalleled efficiency. Discover the value and benefits of the LPC1776FET180,551 today and revolutionize your next project with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and making integration easier.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Address Bus Width: 20

A wider address bus allows for greater memory addressing capabilities, enabling more complex applications to be implemented.

Package Shape: SQUARE

The square shape of the package is well-suited for modern PCB layouts, maximizing space efficiency and ease of routing.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sets and perform more complex calculations efficiently.

DAC Channels: YES

Integrated DAC channels provide the capability for analog output, making the microcontroller suitable for applications requiring precise analog control.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common power sources and stable operation in various environments.

No. of Terminals: 180

A high number of terminals allow for versatile connectivity options and the potential for more I/O capabilities in the design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact form factor, making it suitable for space-constrained applications and enabling high-density PCB designs.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures a wide operating voltage range, increasing compatibility with various power sources and battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in harsh environments, making this microcontroller suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers a balance of performance and power efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable operation in cold environments, ideal for applications in automotive or outdoor settings.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides reliable connectivity and corrosion resistance, ensuring long-term performance of the microcontroller.

ADC Channels: YES

The presence of ADC channels enables analog input capabilities, making this microcontroller suitable for applications requiring precise analog data acquisition.

DMA Channels: YES

Integrated DMA channels enhance data transfer efficiency, enabling high-speed data processing and reducing CPU load for optimized performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, facilitating easier integration of the microcontroller into the design.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program code and data, making the microcontroller suitable for complex firmware applications.

Maximum Seated Height: 1.2 mm

The low seated height enables the microcontroller to be used in slim and compact designs, reducing overall device height and saving space.

Width: 12 mm

The compact width of the microcontroller is suitable for space-constrained applications, enabling efficient PCB layout and integration.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer and processing, enhancing the microcontroller's performance in data-intensive applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast data processing and execution of instructions, making this microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering during assembly, guaranteeing reliable connections and long-term performance of the microcontroller.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for efficient soldering processes, ensuring reliable connections and robust assembly.

Length: 12 mm

The compact length of the microcontroller contributes to a smaller overall footprint, making it suitable for compact device designs and space-saving applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations, suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and power efficiency, making it suitable for a wide range of embedded applications.

RAM Bytes: 81920

The generous amount of RAM allows for efficient data processing and temporary storage, enabling the microcontroller to handle complex tasks and multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form enables reliable soldering connections and simplifies the assembly process, ensuring secure mounting and electrical connections.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with common power sources and stable operation in various electronic devices.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, making this microcontroller suitable for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy and convenient updating of firmware, allowing for flexibility and adaptability in the microcontroller's functionality.

Terminal Pitch: 0.8 mm

The fine terminal pitch facilitates high-density PCB design, enabling compact layouts and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 ensures proper handling and storage requirements to prevent damage during assembly and operation.

Speed: 120 rpm

The specified speed rating of 120 rpm indicates the microcontroller's processing capability, suitable for handling real-time tasks and high-speed applications.

No. of I/O Lines: 141

A high number of I/O lines provide connectivity options for interfacing with external devices and sensors, enabling versatile applications and data exchange.

Technical Specifications

Microcontrollers LPC1776FET180,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

20

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B180

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

141

No. of Terminals:

180

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA180,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LPC1776FET180,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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