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LPC1752FBD80,551

NXP Semiconductors

LPC1752FBD80,551 by NXP Semiconductors

NXP Semiconductors' LPC1752FBD80,551 is a 32-bit microcontroller with Cortex-M3 CPU. It operates at 25 MHz, has 6-Ch 12-Bit ADCs, and offers 52 I/O lines. Ideal for industrial applications due to its -40 to 85 °C operating temperature range and low profile flatpack package style.

Median Price

$8.210

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 119 parts In-Stock

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$5.210

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Arrow

USA . 7 parts In-Stock

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$10.926

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$8.836

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$8.410

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7

$10.926

$8.836

$8.410

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DigiKey

USA . 557 parts In-Stock

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$8.210

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557

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Flip Electronics (Authorized)

USA . 557 parts In-Stock

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Verical

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$9.492

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Rochester

USA . 357 parts In-Stock

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$5.210

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$4.660

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$4.380

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$4.380

Distributors (In-Stock)

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Digiode

USA . 4,502 parts In-Stock

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$5.285

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Nova Conductors

Japan . 700 parts In-Stock

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$5.577

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Vyrian

USA . 2,120 parts In-Stock

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Anansix

USA . 2,010 parts In-Stock

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Flip Electronics

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Sternenhof Electronics

Switzerland . 659 parts In-Stock

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Classic Components Corporation

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Prism Electronics

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Inventory MP

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Bristol Electronics

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Distributors (Availability)

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Semicontronic

India . 297 parts In-Stock

1+ parts

$4.730

100+ parts

$4.612

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$4.588

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$4.588

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$4.730

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Corphita

USA . 3,113 parts In-Stock

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$5.007

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Aranea Global

USA . 1,000 parts In-Stock

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$5.466

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$5.247

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Microchip USA

USA . 992 parts In-Stock

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$12.395

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$12.395

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Aztec Data Supply Inc.

USA . 340 parts In-Stock

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$16.500

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Lixinc

USA . 15,673 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Perfect Parts

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Continental Prestige Electronics

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UNI Independent Distributors

Spain . 3,580 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 1,137 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 357 parts In-Stock

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iodParts Technologies Inc.

India . 56 parts In-Stock

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Overview

Elevate your projects with the LPC1752FBD80,551 by NXP Semiconductors, a top-tier microcontroller that boasts unparalleled quality and reliability. Designed by industry leader NXP Semiconductors, this versatile device offers endless possibilities in a variety of applications. From IoT devices to consumer electronics, this powerhouse delivers exceptional performance with its advanced features and cutting-edge technology. Experience the value and benefits of seamless connectivity, robust peripherals, and unmatched efficiency with the LPC1752FBD80,551. Upgrade your designs today and unlock endless potential with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Bit Size: 32

32-bit architecture allows for higher processing capabilities and performance compared to lower bit architectures, making the microcontroller suitable for complex tasks.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh or extreme temperature conditions, increasing the overall reliability of the product.

ADC Channels: YES

Presence of Analog to Digital Convertor (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and reduced power consumption, making the microcontroller suitable for low-power applications or battery-operated devices.

Technical Specifications

Microcontrollers LPC1752FBD80,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

52

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, SSP(2), UART(4)

Peripherals:

BOD, DMA(8), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

LPC1752FBD80,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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