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LPC1751FBD80K

NXP Semiconductors

LPC1751FBD80K by NXP Semiconductors

NXP Semiconductors' LPC1751FBD80K microcontroller features a 32-bit Cortex-M3 CPU, 11 timers, and 6-channel 12-bit ADCs. With connectivity options like CAN, I2C, SPI, UART, and USB, it's ideal for applications requiring low power consumption and high-speed processing up to 25 MHz. The device operates in a wide temperature range (-40°C to +85°C) making it suitable for various industrial automation and IoT projects.

Median Price

$5.074

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 56 parts In-Stock

1+ parts

$4.670

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-

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56

$4.670

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Arrow

USA . 1 parts In-Stock

1+ parts

$6.474

100+ parts

$4.994

1k+ parts

$4.762

10k+ parts

$4.660

1

$6.474

$4.994

$4.762

$4.660

Verical

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

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$5.477

10k+ parts

$5.360

1,785

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-

$5.477

$5.360

Rochester

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$4.590

1k+ parts

$4.110

10k+ parts

$3.860

191

-

$4.590

$4.110

$3.860

Distributors (In-Stock)

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Digiode

USA . 3,045 parts In-Stock

1+ parts

$4.436

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3,045

$4.436

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Nova Conductors

Japan . 63 parts In-Stock

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$6.032

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63

$6.032

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Bristol Electronics

USA . 102 parts In-Stock

1+ parts

$8.436

100+ parts

$3.965

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102

$8.436

$3.965

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Vyrian

USA . 5,668 parts In-Stock

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5,668

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Anansix

USA . 2,804 parts In-Stock

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Sensible Micro Corp

USA . 249 parts In-Stock

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249

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J2 Sourcing AB

Sweden . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 286 parts In-Stock

1+ parts

$3.970

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286

$3.970

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Corphita

USA . 2,105 parts In-Stock

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$4.203

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2,105

$4.203

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Netroflash

USA . 50 parts In-Stock

1+ parts

$6.032

100+ parts

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1k+ parts

$5.730

10k+ parts

$5.610

50

$6.032

-

$5.730

$5.610

Vigor

Singapore . 1,604 parts In-Stock

1+ parts

$7.250

100+ parts

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1,604

$7.250

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QUARKTWIN TECHNOLOGY LTD

USA . 24,686 parts In-Stock

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24,686

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Microchip USA

USA . 8,922 parts In-Stock

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8,922

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Lixinc

USA . 6,921 parts In-Stock

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6,921

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UNI Independent Distributors

Spain . 1,369 parts In-Stock

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1,369

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Overview

Unlock the power of advanced technology with the LPC1751FBD80K microcontroller by NXP Semiconductors. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. From automotive to industrial automation, this versatile microcontroller delivers unmatched value and efficiency, making it the ideal choice for your next project. Experience seamless connectivity, low power consumption, and superior functionality with the LPC1751FBD80K - the future of innovation is here.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wider operating range and flexibility in power supply options.

No. of Terminals: 80

Provides ample connectivity options for interfacing with external components and peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers efficient processing and quick execution of instructions.

Connectivity: CAN, I2C(3), SPI(2), SSP(2), UART(4), USB

Supports multiple communication protocols, enabling seamless integration with various devices.

Technical Specifications

Microcontrollers LPC1751FBD80K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

8

No. of External Interrupts:

1

No. of I/O Lines:

52

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(3), SPI(2), SSP(2), UART(4), USB

Peripherals:

BOD, DMA(8), POR, RTC, PWM, TIMER(11), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

LPC1751FBD80K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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