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LPC1519JBD100E

NXP Semiconductors

LPC1519JBD100E by NXP Semiconductors

NXP Semiconductors' LPC1519JBD100E is a 32-bit microcontroller with 262144 ROM words, 36864 RAM bytes, and 76 I/O lines. Operating at up to 25 MHz, it features DAC and ADC channels for industrial applications requiring a max temperature of 105°C.

Median Price

$7.368

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,724 parts In-Stock

1+ parts

$7.368

100+ parts

$6.012

1k+ parts

$5.721

10k+ parts

-

1,724

$7.368

$6.012

$5.721

-

DigiKey

USA . 1,920 parts In-Stock

1+ parts

$10.830

100+ parts

$7.258

1k+ parts

$6.567

10k+ parts

-

1,920

$10.830

$7.258

$6.567

-

Mouser Electronics

USA . 69 parts In-Stock

1+ parts

$12.200

100+ parts

$8.200

1k+ parts

$7.140

10k+ parts

$6.870

69

$12.200

$8.200

$7.140

$6.870

Verical

USA . 1,724 parts In-Stock

1+ parts

-

100+ parts

$6.012

1k+ parts

$5.721

10k+ parts

-

1,724

-

$6.012

$5.721

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Avnet

USA . 90 parts In-Stock

1+ parts

-

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1k+ parts

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90

-

-

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EBV Elektronik

Germany . 90 parts In-Stock

1+ parts

-

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-

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90

-

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Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$5.710

1k+ parts

$5.110

10k+ parts

$4.810

90

-

$5.710

$5.110

$4.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

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200

$8.500

-

-

-

Digiode

USA . 255 parts In-Stock

1+ parts

$8.987

100+ parts

-

1k+ parts

-

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255

$8.987

-

-

-

Chip Stock

USA . 14,500 parts In-Stock

1+ parts

-

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14,500

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Vyrian

USA . 8,005 parts In-Stock

1+ parts

-

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8,005

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-

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NAC Semi

USA . 3,060 parts In-Stock

1+ parts

-

100+ parts

$9.070

1k+ parts

-

10k+ parts

$8.370

3,060

-

$9.070

-

$8.370

Anansix

USA . 1,603 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,603

-

-

-

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IBS Electronics

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$6.903

1k+ parts

$6.786

10k+ parts

-

70

-

$6.903

$6.786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,053 parts In-Stock

1+ parts

$4.110

100+ parts

-

1k+ parts

-

10k+ parts

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2,053

$4.110

-

-

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Semicontronic

India . 1,960 parts In-Stock

1+ parts

$4.110

100+ parts

$4.007

1k+ parts

$3.987

10k+ parts

-

1,960

$4.110

$4.007

$3.987

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$8.330

100+ parts

-

1k+ parts

$7.997

10k+ parts

-

50

$8.330

-

$7.997

-

Continental Prestige Electronics

USA . 1,711 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

$8.330

1,711

$8.500

-

-

$8.330

Corphita

USA . 1,186 parts In-Stock

1+ parts

$8.514

100+ parts

-

1k+ parts

-

10k+ parts

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1,186

$8.514

-

-

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$9.419

100+ parts

$8.666

1k+ parts

$8.120

10k+ parts

-

70

$9.419

$8.666

$8.120

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Corohmni

South Africa . 901 parts In-Stock

1+ parts

$52.467

100+ parts

-

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901

$52.467

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Aztec Data Supply Inc.

USA . 4,662 parts In-Stock

1+ parts

$56.230

100+ parts

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4,662

$56.230

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QUARKTWIN TECHNOLOGY LTD

USA . 17,007 parts In-Stock

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17,007

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Lixinc

USA . 14,931 parts In-Stock

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14,931

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Microchip USA

USA . 3,607 parts In-Stock

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3,607

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Robosynatics

Brazil . 3,487 parts In-Stock

1+ parts

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3,487

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-

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Lucentia Tech

USA . 3,487 parts In-Stock

1+ parts

-

100+ parts

$37.234

1k+ parts

$36.474

10k+ parts

$36.474

3,487

-

$37.234

$36.474

$36.474

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,473 parts In-Stock

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2,473

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Perfect Parts

USA . 1,714 parts In-Stock

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1,714

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UNI Independent Distributors

Spain . 1,061 parts In-Stock

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1,061

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Unlock the full potential of your projects with the LPC1519JBD100E microcontroller by NXP Semiconductors. Designed with cutting-edge technology and superior quality materials, this microcontroller offers unmatched performance and reliability for a wide range of applications. With features like DAC and ADC channels, DMA support, and a powerful Cortex-M3 CPU, this product provides exceptional value and functionality to customers looking to create innovative solutions. Trust NXP Semiconductors for top-of-the-line microcontrollers that deliver results beyond expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, making the product ideal for mass production and integration into various electronics devices.

Maximum Supply Voltage: 3.3 V

With a maximum supply voltage of 3.3 V, this microcontroller is compatible with a wide range of power sources and can be used in different voltage scenarios.

Package Shape: SQUARE

The square package shape gives the microcontroller a compact footprint, saving space on the circuit board and enabling more efficient design layouts.

Bit Size: 32

The 32-bit architecture of the microcontroller provides high computational power and performance, making it suitable for complex computing tasks and applications.

DAC Channels: YES

The presence of DAC channels allows for the generation of analog signals with high precision and accuracy, enabling the microcontroller to interface with various analog sensors and devices.

Power Supplies (V): 2.5/3.3

The microcontroller supports dual power supply voltages of 2.5V and 3.3V, offering flexibility in power input options and compatibility with different electronic systems.

No. of Terminals: 100

Having 100 terminals provides a wide range of connectivity options for interfacing with external components, peripherals, and sensors, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style makes the microcontroller suitable for compact and space-constrained applications, offering ease of integration into small form factor devices.

Minimum Supply Voltage: 2.4 V

The minimum supply voltage of 2.4 V ensures the microcontroller can operate under low power conditions, making it energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microcontroller can withstand harsh environmental conditions and maintain reliable performance in industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance, low power consumption, and advanced features, making the microcontroller ideal for a wide range of embedded applications requiring real-time processing.

Minimum Operating Temperature: -40 °C

The microcontroller can operate at temperatures as low as -40°C, ensuring reliability in cold environments and making it suitable for use in various industrial and outdoor applications.

Terminal Finish: TIN

The use of tin as the terminal finish provides good electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance of the microcontroller.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals from external sensors into digital data for processing, making it suitable for applications that require precise analog-to-digital conversion.

DMA Channels: YES

Having DMA channels allows for efficient data transfer and processing without CPU intervention, enhancing the microcontroller's performance in handling large volumes of data and real-time tasks.

Terminal Position: QUAD

The quad terminal position provides multiple orientation options for connecting external components, facilitating ease of circuit board layout and assembly.

ROM Words: 262144

With a ROM size of 262144 words, the microcontroller can store a large amount of program code and data, enabling the implementation of complex algorithms and applications.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for slim and compact designs, making the microcontroller suitable for applications where space is limited.

Width: 14 mm

The compact width of 14 mm enables the microcontroller to fit into small enclosures and tight spaces, offering flexibility in design and integration.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, the microcontroller can execute instructions at a high speed, ensuring efficient performance in demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand the peak reflow temperature for up to 30 seconds during the soldering process, ensuring proper solder joint formation and reliability in manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables the microcontroller to undergo the solder reflow process efficiently, ensuring secure and reliable solder connections.

Length: 14 mm

The compact length of 14 mm contributes to the overall small footprint of the microcontroller, allowing for space-efficient designs in various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for industrial automation, control systems, and other rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various integrated peripherals, this product offers efficient processing capabilities and versatile functionality for a wide range of embedded applications.

RAM Bytes: 36864

With 36864 bytes of RAM, the microcontroller can store and access data quickly during program execution, facilitating efficient operation and multitasking performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high speed, and reliable operation, making the microcontroller suitable for battery-operated devices and energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections during PCB assembly, ensuring long-term performance and durability of the microcontroller in various operating conditions.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides a stable power source for the microcontroller, ensuring consistent and reliable operation in a wide range of electronic devices and systems.

PWM Channels: YES

The inclusion of PWM channels allows the microcontroller to generate precise pulse-width modulated signals for controlling motors, actuators, and other devices, enhancing its versatility in various control applications.

ROM Programmability: FLASH

The flash ROM programmability enables the microcontroller to be easily reprogrammed and updated with new software, facilitating flexibility and adaptability in applications that require frequent changes or updates.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on circuit boards, allowing for more compact and efficient PCB designs with enhanced connectivity options.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller is suitable for standard surface mount soldering processes, ensuring reliable performance and solder joint integrity during assembly.

Speed: 72 rpm

The maximum speed of 72 rpm allows the microcontroller to execute instructions quickly and efficiently, making it ideal for applications requiring real-time processing and rapid data handling.

No. of I/O Lines: 76

Having 76 I/O lines provides ample interfacing options for connecting external devices, sensors, and peripherals, making the microcontroller versatile and adaptable to a wide range of input and output requirements.

Technical Specifications

Microcontrollers LPC1519JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC1519JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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