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LPC1347FHN33,551

NXP Semiconductors

LPC1347FHN33,551 by NXP Semiconductors

NXP Semiconductors' LPC1347FHN33,551 is a 32-bit microcontroller with 3.3V power supply, 25MHz clock frequency, and 8192 bytes of RAM. Ideal for industrial applications, it features a Cortex-M3 CPU family and FLASH ROM programmability for efficient processing in temperature ranges from -40 to 85°C.

Median Price

$6.127

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 570 parts In-Stock

1+ parts

$7.570

100+ parts

$4.340

1k+ parts

$4.250

10k+ parts

$4.110

570

$7.570

$4.340

$4.250

$4.110

DigiKey

USA . 268 parts In-Stock

1+ parts

$8.030

100+ parts

$5.251

1k+ parts

$5.003

10k+ parts

-

268

$8.030

$5.251

$5.003

-

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.684

10k+ parts

-

9,880

-

-

$4.684

-

Future Electronics

Canada . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.750

10k+ parts

$3.730

520

-

-

$3.750

$3.730

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 520 parts In-Stock

1+ parts

$6.093

100+ parts

-

1k+ parts

-

10k+ parts

-

520

$6.093

-

-

-

Digiode

USA . 4,787 parts In-Stock

1+ parts

$7.268

100+ parts

-

1k+ parts

-

10k+ parts

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4,787

$7.268

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-

-

Vyrian

USA . 7,316 parts In-Stock

1+ parts

-

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7,316

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-

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Anansix

USA . 740 parts In-Stock

1+ parts

-

100+ parts

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740

-

-

-

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IBS Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.875

10k+ parts

$4.849

520

-

-

$4.875

$4.849

NAC Semi

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.710

10k+ parts

-

520

-

-

$6.710

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Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 395 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

$0.074

10k+ parts

$0.074

395

$0.110

-

$0.074

$0.074

Corphita

USA . 1,951 parts In-Stock

1+ parts

$6.885

100+ parts

-

1k+ parts

-

10k+ parts

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1,951

$6.885

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-

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Microchip USA

USA . 5,186 parts In-Stock

1+ parts

$26.376

100+ parts

-

1k+ parts

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10k+ parts

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5,186

$26.376

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-

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UNI Independent Distributors

Spain . 7,949 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,949

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Overview

Unlock the power of innovation with the LPC1347FHN33,551 by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled quality and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional performance and efficiency. Experience seamless integration and enhanced functionality with this advanced technology. Elevate your projects and stay ahead of the competition with the LPC1347FHN33,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller package.

Surface Mount: YES

Allows for easy integration onto circuit boards during manufacturing.

Maximum Supply Voltage: 3.6 V

Can operate efficiently at higher voltage levels, providing flexibility in power supply options.

Bit Size: 32

32-bit architecture allows for enhanced processing power and capability.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the microcontroller.

No. of Terminals: 33

Sufficient number of terminals for connecting external devices and peripherals.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing speed and responsiveness.

CPU Family: CORTEX-M3

Cortex-M3 architecture provides efficient and optimized processing capabilities for the microcontroller.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various environmental conditions.

ADC Channels: YES

Built-in ADC channels enable analog to digital conversion for sensor inputs.

ROM Words: 65536

Large ROM capacity allows for storing program instructions and data.

RAM Bytes: 8192

Sufficient RAM memory for storing and processing data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Microcontrollers LPC1347FHN33,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC1347FHN33,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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